GaAs Beam Lead Schottky Barrier Diodes

MA4E2037, MA4E2039, MA4E2040

M/A-COM Division of AMP Incorporated

Q North America: Tel. (800) 366-2266, Fax (800) 618-8883 Q Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087

Q Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020

www.macom.com

AMP and Connecting at a Higher Level are trademarks.

Specifications subject to change without notice.

V3.001

Electrical Specifications @ T

MA4E2037

MA4E2039

MA4E2040

Single

Anti-parallel

Series Tee

Symbol Parameters and Test Conditions

Units

Min.

Typ.

Max.

Min.

Typ.

Max.

Min.

Typ.

Max.

C

j

Junction Capacitance at 0V at 1 MHz

pF

-

.020

-

-

.020

3

--

.020

3

C

t

Total Capacitance at 0V at 1 MHz

1

pF

.040

.050

.060

0.40

3

.050

3

.060

3

.040

3

.050

3

.060

3

—C

t

Total Capacitance Difference

pF

-

-

-

-

-

-

-

.005

.010

R

s

Series Resistance at +10mA

2

Ohms

-

4

7

-

4

7

-

4

7

V

f1

Forward Voltage at +1mA

Volts

.60

.70

.80

.60

.70

.80

.60

.70

.80

—V

f

Forward Voltage Difference at 1mA

Volts

-

-

-

-

.005

.010

-

.005

.010

V

br

Reverse Breakdown Voltage at -10

µA

Volts

4.5

7

-

-

-

-

4.5

7

-

1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp.

2. Series resistance is determined by measuring the dynamic resistance and subtracting the junction resistance of 2.6 ohms at +10 mA.

3. Capacitance for the MA4E2039 and MA4E2040 is per Schottky diode.

Handling Procedures

The following precautions should be observed to avoid damag-

ing these chips:

Cleanliness:

These devices should be handled in a clean environment. Do not

attempt to clean die after installation.

Static Sensitivity:

Schottky barrier diodes are ESD sensitive and can be damaged

by static electricity. Proper ESD techniques should be used

when handling these devices.

General Handling:

These devices have a polymer layer which provides scratch

protection for the junction area and the anode air bridge. Beam

lead devices must, however, be handled with care since the leads

may easily be distorted or broken by the normal pressures

exerted when handled by tweezers. A vacuum pencil with a #27

tip is recommended for picking and placing. A sharpened

wooden stick which has been dipped in isopropyl alcohol may

also be used as a pick and place tool.

Mounting Techniques

These devices are designed to be inserted onto hard or soft

substrates. Recommended methods of attachment include ther-

mocompression bonding, parallel-gap welding, solder reflow

and conductive epoxy.

See Application Note M541, “Bonding and Handling Proce-

dures for Chip Diode Devices” for Detailed Instructions.

0.0 0

0.0 1

0.1 0

1.0 0

10.00

100.00

0.2 0

0.3 0

0.4 0

0.5 0

0.6 0

0.7 0

0.8 0

0.9 0

1.0 0

F O R W AR D V O L T A G E (V )

T = 1 2 5

T = 2 5

T = -5 0

Typical Forward Characteristics