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S75WS256NDGBAWNH2 Datasheet(PDF) 6 Page - SPANSION |
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S75WS256NDGBAWNH2 Datasheet(HTML) 6 Page - SPANSION |
6 / 15 page 4 S75WS-N Based MCPs S75WS-N_02_A2 October 6, 2005 Prel imi n ary 2 Ordering Information The ordering part number is formed by a valid combination of the following: Package Marking Note: The BGA package marking omits the leading S75 and packing type designator from the ordering part number. Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. S75WS 256 N D F BA W L K 0 Packing Type 0= Tray 2 = 7” Tape and Reel 3 = 13” Tape and Reel RAM Supplier; Speed Combination K = RAM Type 4, 54 MHz J = RAM Type 4, 66 MHz H = RAM Type 4, 80 MHz Package Dimensions and Ball Count; DYB Power Up; Flash Device Family (Data Storage) L = 1.4 mm, 9 x 12, 84 ball; 0, WS as Data Flash N = 1.4 mm, 9 x 12, 84 ball; 1, WS as Data Flash U = 1.4mm, 11x13, 115-ball, x16 ORNAND Data Flash S = 1.4mm, 11x13, 115-ball, x8 ORNAND Data Flash Temperature Range W = Wireless (–25°C to +85°C) Package Type And Material BA = Very Thin Fine-Pitch Ball Grid Array (BGA), Lead (Pb)-free Compliant Package BF = Very Thin Fine-Pitch Ball Grid Array (BGA), Lead (Pb)-free Package Data Flash Density F = 512 Mb G = 1024 Mb RAM Density D = 128 Mb E = 256 Mb Process Technology N = 110 nm, Mirror Bit Technology Code Flash Density 256 = 256 Mb Device Family S75WS = Multi-chip Product (MCP) 1.8-volt Burst Mode Flash Memory, RAM, and data flash Table 2.1 MCP Configurations and Valid Combinations Valid Combination S75WS256N D F BA, BF W L, N K, H Table 2.2 ORNAND Configurations and Valid Combinations Valid Combination S75WS256N E G BA, BF W U, S K, J, H |
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