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LX1993 Datasheet(PDF) 2 Page - Microsemi Corporation

Part # LX1993
Description  High Efficiency LED Driver
Download  12 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

LX1993 Datasheet(HTML) 2 Page - Microsemi Corporation

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Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
© 2000
Rev. 1.0b, 2005-03-03
LX1993
High Efficiency LED Driver
PRODUCTION
I N T E GRA T ED
PR ODUC T S
ABSOLUTE MAXI MUM RATI NGS
Supply Voltage (VIN) ........................................................................-0.3V to 7.0V
Feedback Input Voltage (VFB) ................................................-0.3V to VIN + 0.3V
Shutdown Input Voltage (V
SHDN) ...........................................-0.3V to VIN + 0.3V
Adjust Input Voltage (VADJ) ....................................................-0.3V to VIN +0.3V
Output Voltage (VOUT).......................................................................-0.3V to 25V
Switch Voltage (VSW) ........................................................-0.3V to (VOUT + 1.0V)
Switch Current (ISW) .............................................................................500mArms
Operating Junction Temperature.................................................................. 150°C
Storage Temperature Range...........................................................-65°C to 150°C
Peak Package Solder Reflow Temp. (40 second max. exposure) ... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
TH ERM A L DATA
DU
Plastic MSOP 8-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θJA
206
°C/W
THERMAL RESISTANCE
-JUNCTION TO CASE,
θJC
39
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
PACKAGE PIN OUT
1
2
4
3
5
6
8
7
SW
FB
IN
GND
OUT
CS
ADJ
DU PACKAGE
(Top View)
SHDN
RoHS / Pb-free 100% Matte Tin Lead Finish
FRONT MARKING
pin 1 indicator
FUNCTIONAL PIN DESCRIPTION
NAME
DESCRIPTION
IN
Unregulated IC Supply Voltage Input – Input range from +1.6V to +6.0V. Bypass with a 1µF or greater capacitor
for low voltage operation.
FB
Feedback Input – Connect to a current sense resistor between the load and GND to set the maximum output
current.
SHDN
Active-Low Shutdown Input – A logic low shuts down the device and reduces the supply current to <1µA.
Connect SHDN to VCC for normal operation.
SW
Inductor Switching Connection – Internally connected to the drain of a 28V N-channel MOSFET. SW is high
impedance in shutdown.
CS
Current-Sense Amplifier Input – Connecting a resistor between CS and GND sets the peak inductor current limit.
GND
Common terminal for ground reference.
ADJ
Output Current Adjustment Input – Provides the internal reference for the output current feedback. The signal
input can be either a PWM signal or analog voltage allowing a dynamic output current adjustment. The signal
should typically range from 500mV to GND, but is capable of an input up to VIN. Caution should be used not to
exceed the device output current rating.
OUT
Output Current - Adjustable up to 25mA. Load voltage should not exceed 25V.
1993
C
• MSC


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