Electronic Components Datasheet Search |
|
S70GL256M00FFIIRD0 Datasheet(PDF) 4 Page - SPANSION |
|
S70GL256M00FFIIRD0 Datasheet(HTML) 4 Page - SPANSION |
4 / 60 page 2 S70GL256M00 S70GL256M00_00_A1 October 31, 2006 D A T A SH EE T GENERAL DESCRIPTION The S70GL256M00 consists of two 128 Mbit, 3.0 volt single power supply flash memory devices and is or- ganized as 8,388,608 doublewords or 16,777,216 words. The device has a 32-bit wide data bus that can also function as an 16-bit wide data bus by using the WORD# input. The device can be programmed either in the host system or in standard EPROM program- mers. An access time of 110 or 120 ns is available. Note that each access time has a specific operating voltage range (V CC) as specified in the Product Selector Guide and the Ordering Information sections. The device is offered in an 80-ball Fortified BGA package. Each de- vice has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls. Each device requires only a single 3.0 volt power supply for both read and write functions. In addition to a V CC input, a high-voltage accelerated program (WP#/ACC) input provides shorter programming times through increased current. This feature is intended to facilitate factory throughput during system production, but may also be used in the field if desired. The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the device using standard microprocessor write timing. Write cycles also inter- nally latch addresses and data needed for the pro- gramming and erase operations. The sector erase architecture allows memory sec- tors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory. Device programming and erasure are initiated through command sequences. Once a program or erase oper- ation has begun, the host system need only poll the DQ7 and DQ15 (Data# Polling) or DQ6 and DQ14 (toggle) status bits or monitor the Ready/Busy# (RY/BY#) outputs to determine whether the operation is complete. To facilitate programming, an Unlock By- pass mode reduces command sequence overhead by requiring only two write cycles to program data instead of four. The VersatileI/O™ (V IO) control allows the host sys- tem to set the voltage levels that the device generates and tolerates on the CE# control input and DQ I/Os to the same voltage level that is asserted on the V IO pin. Refer to the Ordering Information section for valid V IO options. Hardware data protection measures include a low V CC detector that automatically inhibits write opera- tions during power transitions. The hardware sector group protection feature disables both program and erase operations in any combination of sector groups of memory. This can be achieved in-system or via pro- gramming equipment. The Erase Suspend/Erase Resume feature allows the host system to pause an erase operation in a given sector to read or program any other sector and then complete the erase operation. The Program Sus- pend/Program Resume feature enables the host sys- tem to pause a program operation in a given sector to read any other sector and then complete the program operation. The hardware RESET# pin terminates any operation in progress and resets the device, after which it is then ready for a new operation. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the host system to read boot-up firmware from the Flash memory device. The device reduces power consumption in the standby mode when it detects specific voltage levels on CE# and RESET#, or when addresses have been stable for a specified period of time. The SecSi ™ (Secured Silicon) Sector provides a 128-doubleword/256-word area for code or data that can be permanently protected. Once this sector is pro- tected, no further changes within the sector can occur. The Write Protect (WP#/ACC) feature protects the first or last sector by asserting a logic low on the WP# pin. Spansion MirrorBitTM flash technology combines years of Flash memory manufacturing experience to pro- duce the highest levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a sector simultaneously via hot-hole assisted erase. The data is programmed using hot electron in- jection. RELATED DOCUMENTS For a comprehensive information on MirrorBit prod- ucts, including migration information, data sheets, ap- plication notes, and software drivers, please see www.amd.com →Flash Memory→Product Informa- tion →MirrorBit→Flash Information→Technical Docu- mentation. The following is a partial list of documents closely related to this product: MirrorBit™ Flash Memory Write Buffer Programming and Page Buffer Read Implementing a Common Layout for Spansion Mirror- Bit and Intel StrataFlash Memory Devices Migrating from Single-byte to Three-byte Device IDs |
Similar Part No. - S70GL256M00FFIIRD0 |
|
Similar Description - S70GL256M00FFIIRD0 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |