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PM6681ATR Datasheet(PDF) 9 Page - STMicroelectronics |
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PM6681ATR Datasheet(HTML) 9 Page - STMicroelectronics |
9 / 12 page PM6681A Package mechanical data 9/12 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 2. VFQFPN 5x5x1.0 32L Pitch 0.50 Dim. Databook (mm) Min Typ Max A0.8 0.9 1 A1 0 0.02 0.05 A3 0.2 b 0.18 0.25 0.3 D4.85 5 5.15 D2 See exposed pad variations (2) E4.85 5 5.15 E2 See exposed pad variations (2) e0.5 L 0.3 0.4 0.5 ddd 0.05 Table 3. Exposed pad variations (1)(2)D2 1. VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead. Very thin: A = 1.00mm Max. 2. Dimensions D2 & E2 are not in accordance with JEDEC. E2 Min Typ Max Min Typ Max 2.90 3.10 3.20 2.90 3.10 3.20 |
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