Pin Descriptions

Pin

Name

TQFP Pin

Number

LLP Pin

Number

I/O, Type

Description

DIFFERENTIAL INPUTS

IN0+

IN0−

13

14

9

10

I, LVDS

Channel 0 inverting and non-inverting differential inputs.

IN1+

IN1−

15

16

11

12

I, LVDS

Channel 1 inverting and non-inverting differential inputs.

IN2+

IN2−

19

20

13

14

I, LVDS

Channel 2 inverting and non-inverting differential inputs.

IN3+

IN3−

21

22

15

16

I, LVDS

Channel 3 inverting and non-inverting differential inputs.

DIFFERENTIAL OUTPUTS

OUT0+

OUT0−

48

47

32

31

O, LVDS

Channel 0 inverting and non-inverting differential outputs. (Note 2)

OUT1+

OUT1−

46

45

30

29

O, LVDS

Channel 1 inverting and non-inverting differential outputs. (Note 2)

OUT2+

OUT2−

42

41

28

27

O, LVDS

Channel 2 inverting and non-inverting differential outputs. (Note 2)

OUT3+

OUT3-

40

39

26

25

O, LVDS

Channel 3 inverting and non-inverting differential outputs. (Note 2)

DIGITAL CONTROL INTERFACE

PWDN

12

8

I, LVTTL

A logic low at PWDN activates the hardware power down mode (all

channels).

PEM

2

2

I, LVTTL

Pre-emphasis Control Input (affects all Channels)

POWER

V

DD

3, 4, 5, 7, 10,

11, 28, 29, 32,

33

3, 4, 6, 7,

20, 21

I, Power

V

GND

8, 9, 17, 18, 23,

24, 37, 38, 43,

44

5 (Note 1)

I, Ground

Ground reference for LVDS and CMOS circuitry. For the LLP package, the

DAP is used as the primary GND connection to the device in addition to the

pin numbers listed. The DAP is the exposed metal contact at the bottom of

the LLP-32 package. It should be connected to the ground plane with at

least 4 vias for optimal AC and thermal performance.

N/C

1,6, 25, 26, 27,

30, 31, 34, 35,

36

1, 17,

18,19,22,

23, 24

No Connect

Note 1: Note that for the LLP package the GND is connected thru the DAP on the back side of the LLP package in addition to the actual pin numbers listed.

Note 2: The LVDS outputs do not support a multidrop (BLVDS) environment. The LVDS output characteristics of the DS15BR400 and DS15BR401 are optimized

for point-to-point backplane and cable applications.

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