ADT6503 datasheet(11/16 Pages) AD

Part #	ADT6503

Description	Low Cost, 2.7 V to 5.5 V, Micropower Temperature Switches in SOT-23

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Manufacturer	AD [Analog Devices]

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11 / 16 page

Preliminary Technical Data

ADT6501/ADT6502/ADT6503/ADT6504

Rev. PrA | Page 11 of 16

TEMPERATURE MONITORING

The ADT6501/ADT6502/ADT6503/ADT6504 are ideal for

monitoring the thermal environment within electronic

equipment. For example, the surface-mount package accurately

reflects the exact thermal conditions that affect nearby

integrated circuits.

The ADT650x measure and convert the temperature at the

surface of its own semiconductor chip. When the ADT650x are

used to measure the temperature of a nearby heat source, the

thermal impedance between the heat source and the ADT650x

must be as low as possible.

As much as 60% of the heat transferred from the heat source to

the thermal sensor on the ADT650x die is discharged via the

copper tracks, package pins, and bond pads. Of the pins on the

ADT650x, the GND pins transfer most of the heat. Therefore,

to monitor the temperature of a heat source it is recommended

that the thermal resistance between the ADT650x GND pins

and the GND of the heat source is reduced as much as possible.

For example, use the unique properties of the ADT650x to

monitor a high power dissipation microprocessor. The

ADT650x device, in its SOT-23 package, is mounted directly

beneath the microprocessor’s pin grid array (PGA) package.

The ADT650x requires no external characterization.

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