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ADD8708WCPZ-REEL7 Datasheet(PDF) 11 Page - Analog Devices |
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ADD8708WCPZ-REEL7 Datasheet(HTML) 11 Page - Analog Devices |
11 / 16 page ADD8708 Rev. 0 | Page 11 of 16 VOLTAGE REGULATOR The on-board voltage regulator provides a regulated voltage to the resistor chain to provide stable gamma voltages. The two mask-programmable internal resistors, R1 and R2, and a reference voltage set the output of the regulator. The typical values of these parts are shown in Figure 23. In addition, see the Tap Point and Regulator Voltage Request Form in this data sheet. VREF 1.2V + – R2 55k Ω R1 5k Ω VREG OUT Figure 23. Voltage Regulator The internal resistors have a typical accuracy of 0.1%. External resistors can be used to adjust the regulator voltage; however, it is not recommended. Please contact your local sales office for further details. MAXIMUM POWER DISSIPATION The maximum safe power dissipation in the ADD8708 package is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, the glass transition tempera- ture, the properties of the plastic change. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the para- metric performance of the ADD8708. Exceeding a junction temperature of 175°C for an extended period can result in changes in the silicon devices, potentially causing failure. LAND PATTERN The LFCSP package comes with a thermal pad. Soldering down this thermal pad dramatically improves the heat dissipation of the package. It is necessary to attach vias that connect the soldered thermal pad to another layer on the board. This provides an avenue to dissipate the heat away from the part. Without vias, the heat is isolated directly under the part. Subdivide the solder paste, or stencil layer, for the thermal pad to reduce solder balling and splatter. It is not critical how the subdivisions are arranged, as long as the total coverage of the solder paste for the thermal pad is greater than 50%. The land pattern is critical to heat dissipation. A suggested land pattern is shown in Figure 22. The thermal pad is attached to the substrate. In the ADD8708, the substrate is connected to VDD. To be electrically safe, the thermal pad should be soldered to an area on the board that is electrically isolated or connected to VDD. Attaching the thermal pad to ground adversely affects the performance of the part. |
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