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ESD5B5.0ST1G Datasheet(PDF) 1 Page - ON Semiconductor

Part # ESD5B5.0ST1G
Description  Transient Voltage Suppressor Bi-directional Micro-Packaged Diode for ESD Protection
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

ESD5B5.0ST1G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 1
1
Publication Order Number:
ESD5B5.0ST1/D
ESD5B5.0ST1G
Transient Voltage
Suppressor
Bi−directional Micro−Packaged Diode for
ESD Protection
The ESD5B Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size and bi−directional
design, it is ideal for use in cellular phones, MP3 players, and portable
applications that require audio line protection.
Specification Features
Small Body Outline Dimensions: nom 0.063″ x 0.032″ (1.6x0.8 mm)
Low Body Height: nom 0.024″ (0.6 mm)
Reverse Working (Stand−off) Voltage: 5.0 V
Peak Power up to 50 W @ 8 x 20 ms Pulse
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC61000−4−2 Level 4 ESD Protection
This is a Pb−Free Device
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH:
100% Matte Sn (Tin)
MOUNTING POSITION:
Any
QUALIFIED MAX REFLOW TEMPERATURE:
260
°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
±30
kV
ESD Voltage
Per Human Body Model
Per Machine Model
16
400
kV
V
Peak Power (Figure 1) Per 8 x 20
ms Waveform
Peak Power (Figure 2) Per 10 x 1000
ms Waveform
PPK
50
10
W
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
°PD°
200
mW
Junction and Storage Temperature Range
TJ, Tstg
−55 to
+150
°C
Lead Solder Temperature − Maximum
(10 Second Duration)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
Device
Package
Shipping
ORDERING INFORMATION
SOD−523
CASE 502
PLASTIC
MARKING DIAGRAM
http://onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
http://onsemi.com
B5
= Specific Device Code
M
Date Code
G
= Pb−Free Package
B5 M
G
G
(Note: Microdot may be in either location)
ESD5B5.0ST1G
SOD−523
(Pb−Free)
3000/Tape & Reel


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