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ESD5B5.0ST1G Datasheet(PDF) 1 Page - ON Semiconductor |
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ESD5B5.0ST1G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 3 page © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 1 1 Publication Order Number: ESD5B5.0ST1/D ESD5B5.0ST1G Transient Voltage Suppressor Bi−directional Micro−Packaged Diode for ESD Protection The ESD5B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size and bi−directional design, it is ideal for use in cellular phones, MP3 players, and portable applications that require audio line protection. Specification Features • Small Body Outline Dimensions: nom 0.063″ x 0.032″ (1.6x0.8 mm) • Low Body Height: nom 0.024″ (0.6 mm) • Reverse Working (Stand−off) Voltage: 5.0 V • Peak Power up to 50 W @ 8 x 20 ms Pulse • Low Leakage • Response Time is Typically < 1 ns • ESD Rating of Class 3 (> 16 kV) per Human Body Model • IEC61000−4−2 Level 4 ESD Protection • This is a Pb−Free Device Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260 °C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact ±30 kV ESD Voltage Per Human Body Model Per Machine Model 16 400 kV V Peak Power (Figure 1) Per 8 x 20 ms Waveform Peak Power (Figure 2) Per 10 x 1000 ms Waveform PPK 50 10 W Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C °PD° 200 mW Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 x 0.75 x 0.62 in. Device Package Shipping† ORDERING INFORMATION SOD−523 CASE 502 PLASTIC MARKING DIAGRAM http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com B5 = Specific Device Code M Date Code G = Pb−Free Package B5 M G G (Note: Microdot may be in either location) ESD5B5.0ST1G SOD−523 (Pb−Free) 3000/Tape & Reel |
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