ADP1823 datasheet(5/32 Pages) AD

Part #	ADP1823

Description	Dual, Interleaved, Step-Down DC-to-DC Controller with Tracking

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Manufacturer	AD [Analog Devices]

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ADP1823

Rev. A | Page 5 of 32

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

IN, EN1, EN2

−0.3 V to +20 V

BST1, BST2

−0.3 V to +30 V

BST1, BST2 to SW1, SW2

−0.3 V to +6 V

CSL1, CSL2

−1 V to +30 V

SW1, SW2

−2 V to +30 V

DH1

SW1 − 0.3 V to BST1 + 0.3 V

DH2

SW2 − 0.3 V to BST2 + 0.3 V

DL1, DL2 to PGND

−0.3 V to PV + 0.3 V

PGND to GND

±2 V

LDOSD, SYNC, FREQ, COMP1,

COMP2, SS1, SS2, FB1, FB2, VREG,

PV, POK1, POK2, TRK1, TRK2

−0.3 V to +6 V

θJA 4-Layer

(JEDEC Standard Board)1, 2

45°C/W

Operating Ambient Temperature3

−40°C < TA< +85°C

Operating Junction Temperature3

−40°C < TJ < +125°C

Storage Temperature

−65°C to +150°C

1 Measured with exposed pad attached to PCB.

2 Junction-to-ambient thermal resistance (θJA) of the package is based on

modeling and calculation using a 4-layer board. The junction-to-ambient

thermal resistance is application and board-layout dependent. In

applications where high maximum power dissipation exists, attention to

thermal dissipation issues in board design is required. For more information,

please refer to Application Note AN-772, A Design and Manufacturing Guide

for the Lead Frame Chip Scale Package (LFCSP).

3 In applications where high power dissipation and poor package thermal

resistance are present, the maximum ambient temperature may have to be

derated. Maximum ambient temperature (TA_MAX) is dependent on the

maximum operating junction temperature (TJ_MAX_OP = 125oC), the maximum

power dissipation of the device in the application (PD_MAX), and the junction-

to-ambient thermal resistance of the part/package in the application (θJA), is

given by the following equation: TA_MAX = TJ_MAX_OP – (θJA x PD_MAX).

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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