NCP3488

http://onsemi.com

3

MAXIMUM RATINGS

Rating

Value

Unit

0 to 85

°C

0 to 150

°C

Package Thermal Resistance: SO−8

45

123

°C/W

°C/W

−65 to 150

°C

Lead Temperature Soldering (10 sec): Reflow (SMD styles only)

Pb−Free (Note 3)

260 peak

°C

JEDEC Moisture Sensitivity Level

(260 peak profile)

1

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Internally limited by thermal shutdown, 150°C min.

3. 60−180 seconds minimum above 237°C.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

MAXIMUM RATINGS

Pin Symbol

Pin Name

Main Supply Voltage Input

15 V

−0.3 V

BST

Bootstrap Supply Voltage Input

30 V wrt/PGND

35 V v 50 ns wrt/PGND

15 V wrt/SW

−0.3 V wrt/SW

SW

Switching Node

(Bootstrap Supply Return)

30 V

−1.0 V DC

−10 V< 200 ns

DRVH

High−Side Driver Output

BST + 0.3 V

35 V v 50 ns wrt/PGND

15 V wrt/SW

−0.3 V wrt/SW

DRVL

Low−Side Driver Output

−0.3 V DC

−2.0 V < 200 ns

IN

DRVH and DRVL Control Input

−0.3 V

OD

Output Disable

−0.3 V

PGND

Ground

0 V

0 V

NOTE: All voltages are with respect to PGND except where noted.