NCP5211

http://onsemi.com

2

COMP

GATE(H)

GATE(L)

PGND

IS−

NCP5211

2.5 V/8.0 A

51 k

0.1

mF

LGND

100

mF/10 V × 3

0.1

mF

SENSE+

4.7 k

1.0 k

1.0%

2.9

mH

5.0 V

IS+

SENSE−

+

+

100

mF/10 V × 2

SGND

1.0%

0.1

mF

0.1

mF

10

BST

4.7 k

Figure 1. Application Diagram, 5.0 V to 2.5 V/8.0 A Converter with Differential Remote Sense

10

1.5 k

0.1

mF

Return

680 pF

ORDERING INFORMATION

Device

Operating Temperature Range

Package

Shipping†

NCP5211BDR2G

−40

SOIC−14

(Pb−Free)

2500 / Tape & Reel

NCP5211DR2G

0

SOIC−14

(Pb−Free)

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specification Brochure, BRD8011/D.

MAXIMUM RATINGS

Rating

Value

Unit

150

°C

Lead Temperature Soldering:

Reflow: (SMD styles only) (Note 1)

230 peak

°C

−65 to +150

°C

Package Thermal Resistance,

30

125

°C/W

°C/W

ESD Susceptibility (Human Body Model)

2.0

kV

JEDEC Moisture Sensitivity

1.0

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. 60 second maximum above 183

°C.