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NCP5500DT50RKG Datasheet(PDF) 6 Page - ON Semiconductor |
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NCP5500DT50RKG Datasheet(HTML) 6 Page - ON Semiconductor |
6 / 9 page NCP5500, NCV5500, NCP5501, NCV5501 http://onsemi.com 6 DEFINITION OF TERMS Dropout Voltage: The input−to−output voltage differential at which the circuit ceases to regulate against further reduction input voltage. Measured when the output voltage has dropped 2% relative to the value measured at 6.0 V input, dropout voltage is dependent upon load current and junction temperature. Input Voltage: The DC voltage applied to the input terminals with respect to ground. Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation: The change in output voltage for a change in load current at constant chip temperature. Pulse loading techniques are employed such that the average chip temperature is not significantly affected. Quiescent Current: The part of the positive input current that does not contribute to the positive load current. The regulator ground pin current with no load. Ripple Rejection: The ratio of the peak−to−peak input ripple voltage to the peak−to−peak output ripple voltage. Current Limit: Peak current that can be delivered to the output. Calculating Power Dissipation The maximum power dissipation for a single output regulator (Figure 3) is: PD(max) + VIN(max) * VOUT(min) IOUT(max) ) VIN(max)Iq (eq. 1) Where VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current for the application, IGND is the ground current at IOUT(max). Once the value of PD(max) is known, the maximum permissible value of RqJA can be calculated: RqJA + 150 C * TA PD (eq. 2) ° The value of RqJA can then be compared with those in the package section of the data sheet. Those packages with RqJA less than the calculated value in Equation 2 will keep the die temperature below 150°C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heat sink will be required. Heat sinks A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RqJA: RqJA + RqJC ) RqCS ) RqSA (eq. 3) where RqJC is the junction−to−case thermal resistance, RqCS is the case−to−heatsink thermal resistance, RqSA is the heatsink−to−ambient thermal resistance. RqJC appears in the package section of the data sheet. Like RqJA, it too is a function of package type. RqCS and RqSA are functions of the package type, heat sink and the interface between them. These values appear in data sheets of heat sink manufacturers. Thermal, mounting, and heat sink considerations are further discussed in ON Semiconductor Application Note AN1040/D. |
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