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NCV51411 Datasheet(PDF) 3 Page - ON Semiconductor |
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NCV51411 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 16 page NCV51411 http://onsemi.com 3 PACKAGE PIN DESCRIPTION SO−8 SO−16 DFN−18 PIN SYMBOL FUNCTION 1 15 1 BOOST The BOOST pin provides additional drive voltage to the on−chip NPN power transist- or. The resulting decrease in switch on voltage increases efficiency. 2 16 2, 3, 4 VIN This pin is the main power input to the IC. 3 1 5, 6, 7 VSW This is the connection to the emitter of the on−chip NPN power transistor and serves as the switch output to the inductor. This pin may be subjected to negative voltages during switch off−time. A catch diode is required to clamp the pin voltage in normal operation. This node can stand −1.0 V for less than 50 ns during switch node flyback. 4 2 8 SHDNB Shutdown_bar input. This is an active−low logical input, TTL compatible, with an in- ternal pull−up current source. The IC goes into sleep mode, drawing less than 85 mA when the pin voltage is pulled below 1.0 V. This pin may be left floating in applications where a shutdown function is not required. 5 7 10 SYNC This pin provides the synchronization input. 6 8 13 GND Power return connection for the IC. 7 9 16 VFB The FB pin provides input to the inverting input of the error amplifier. If VFB is lower than 0.29 V, the oscillator frequency is divided by four, and current limit folds back to about 1 ampere. These features protect the IC under severe overcurrent or short cir- cuit conditions. 8 10 17 VC The VC pin provides a connection point to the output of the error amplifier and input to the PWM comparator. Driving of this pin should be avoided because on−chip test circuitry becomes active whenever current exceeding 0.5 mA is forced into the IC. − 3 − 6, 11 − 14 9, 11, 12, 14, 15, 18 NC No Connection SYNC SHDNB 18 GND VSW VFB VIN VC BOOST PIN CONNECTIONS 1 16 VFB GND VC SYNC NC NC NC NC NC NC NC NC BOOST SHDNB VIN VSW 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 BOOST VIN VIN VIN Vsw VSW VSW SHDNB NC NC VC VFB NC NC GND NC NC SYNC SO−8 SO−16W EP 18−Lead DFN Note: DFN exposed pad may be soldered to a heat spreader for enhanced thermal perform- ance. The exposed pad may be connected to GND; do not connect to any other potential. |
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