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PEMB17 Datasheet(PDF) 3 Page - NXP Semiconductors |
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PEMB17 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 11 page 9397 750 14372 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 02 — 3 February 2005 3 of 11 Philips Semiconductors PEMB17; PUMB17 PNP/PNP resistor-equipped transistors; R1 = 47 k Ω, R2 = 22 kΩ 5. Limiting values [1] Device mounted on a FR4 printed-circuit board, single-sided copper, standard footprint. [2] Reflow soldering is the only recommended soldering method. 6. Thermal characteristics [1] Device mounted on a FR4 printed-circuit board, single-sided copper, standard footprint. [2] Reflow soldering is the only recommended soldering method. Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per transistor VCBO collector-base voltage open emitter - −50 V VCEO collector-emitter voltage open base - −50 V VEBO emitter-base voltage open collector - −10 V VI input voltage positive - +10 V negative - −40 V IO output current (DC) - −100 mA ICM peak collector current - −100 mA Ptot total power dissipation Tamb ≤ 25 °C SOT363 [1] - 200 mW SOT666 [1] [2] - 200 mW Tstg storage temperature −65 +150 °C Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Per device Ptot total power dissipation Tamb ≤ 25 °C SOT363 [1] - 300 mW SOT666 [1] [2] - 300 mW Table 7: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor Rth(j-a) thermal resistance from junction to ambient Tamb ≤ 25 °C SOT363 [1] - - 625 K/W SOT666 [1] [2] - - 625 K/W Per device Rth(j-a) thermal resistance from junction to ambient Tamb ≤ 25 °C SOT363 [1] - - 416 K/W SOT666 [1] [2] - - 416 K/W |
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