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ADA4860-1 Datasheet(PDF) 5 Page - Analog Devices

Part No. ADA4860-1
Description  High Speed, Low Cost, Op Amp
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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ADA4860-1
Rev. 0 | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
12.6 V
Power Dissipation
See Figure 3
Common-Mode Input Voltage
−VS + 1 V to +VS − 1 V
Differential Input Voltage
±VS
Storage Temperature Range
−65°C to +125°C
Operating Temperature Range
−40°C to +105°C
Lead Temperature
JEDEC J-STD-20
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for device soldered in circuit board for surface-mount
packages.
Table 4. Thermal Resistance
Package Type
θJA
Unit
6-lead SOT-23
170
°C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4860-1 is
limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a junction temperature of
150°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
The power dissipated in the package (PD) for a sine wave and a
resistor load is the total power consumed from the supply
minus the load power.
PD = Total Power Consumed − Load Power
(
)
L
OUT
CURRENT
SUPPLY
VOLTAGE
SUPPLY
D
R
V
I
V
P
2
×
=
RMS output voltages should be considered.
Airflow across the ADA4860-1 helps remove heat from the
package, effectively reducing θJA. In addition, more metal
directly in contact with the package leads and through holes
under the device reduces θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 6-lead SOT-23
(170°C/W) on a JEDEC standard 4-layer board. θJA values are
approximations.
2.0
1.5
1.0
0.5
0
–40 –30 –20 –10
0
110
100
90
80
70
60
50
40
30
20
10
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.




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