4

SY89536L

Micrel

Supply Voltage (V

V

Input Voltage (V

DC Output Current (I

LVPECL, HSTL outputs ....................................... –50mA

Lead Temperature (soldering, 10 sec.) ..................... 220°C

Storage Temperature (T

Supply Voltage

V

V

Ambient Temperature (T

Package Thermal Resistance (Junction-to-Ambient)

With Die attach soldered to GND:

With Die attach NOT soldered to GND, Note 3:

Package Thermal Resistance (Junction-to-Case)

Power Supply

Symbol

Parameter

Condition

Min

Typ

Max

Units

PLL and Logic Supply Voltage

Note 4

3.0

3.3

3.6

V

3.0

3.3

3.6

V

LVPECL/HSTL

1.6

1.8

2.0

V

Total Supply Current

Note 5

—

230

295

mA

DC ELECTRICAL CHARACTERISTICS

Note 1.

Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is

not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG

conditions for extended periods may affect device reliability.

Note 2.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

Note 3.

It is recommended that the user always solder the exposed die pad to a ground plane for enhanced heat dissipation.

Note 4.

V

separate supply.

Note 5.

No load. Outputs floating, Banks A, B, and C enabled.