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INA-32063 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard) |
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INA-32063 Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard) |
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7 / 11 page  7 0.026 0.075 0.016 0.035 Figure 16. PCB Pad Layout for INA-32063 (dimensions in inches). Statistical Parameters Several categories of parameters appear within this data sheet. Parameters may be described with values that are either “minimum or maximum,” “typical,” or “standard deviations.” The values for parameters are based on compre- hensive product characterization data, in which automated mea- surements are made on a large number of parts taken from 3 non-consecutive process lots of semiconductor wafers. The data derived from product character- ization tends to be normally distributed, e.g., fits the standard “bell curve.” Parameters considered to be the most important to system perfor- mance are bounded by minimum or maximum values. For the INA-32063, these parameters are: Power Gain (|S21|2) and the Device Current (Id). Each of these guaranteed parameters is 100% tested. Values for most of the parameters in the table of Electrical Specifications that are described by typical data are the mathematical mean ( µ), of the normal distribution taken from the characterization data. For parameters where measurements or mathematical averaging may not be practical, such as S-parameters or Noise Param- eters and the performance curves, the data represents a nominal part taken from the “center” of the characterization distribution. Typical values are intended to be used as a basis for electrical design. To assist designers in optimizing not only the immediate circuit using the INA-32063, but to also optimize and evaluate trade-off that affect a complete wireless system, the standard deviation ( σ) is provided for many of the Electrical Specifications param- eters (at 25 °C) in addition to the mean. The standard deviation is a measure of the variability about the mean. It will be recalled that a normal distribution is completely described by the mean and standard deviation. Standard statistics tables or calculations provide the probabil- ity of a parameter falling between any two values, usually symmetri- cally located about the mean. Referring to Figure 17 for ex- ample, the probability of a parameter being between ±1σ is 68.3%; between ±2σ is 95.4%; and between ±3σ is 99.7%. 68% 95% 99% Parameter Value Mean ( µ), typ -3 σ -2σ -1σ +1 σ +2σ +3σ Figure 17. Normal Distribution. SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-363 package, will reach solder reflow temperatures faster than those with a greater mass. The INA-32063 has been qualified to the time-temperature profile shown in Figure 18. This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evapo- rating solvents from the solder paste. The reflow zone briefly elevates the temperature suffi- ciently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cool down zones are chosen to be low enough to not cause deforma- tion of the board or damage to components due to thermal shock. For more information on mount- ing considerations for packaged microwave semiconductors |
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