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NTB52N10T4 Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTB52N10T4
Description  N-Channel Enhancement?묺ode D2PAK
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTB52N10T4 Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 3
1
Publication Order Number:
NTB52N10/D
NTB52N10
Power MOSFET
52 Amps, 100 Volts
N−Channel Enhancement−Mode D2PAK
Features
Source−to−DrainDiode Recovery Time Comparable to a Discrete
Fast Recovery Diode
Avalanche Energy Specified
IDSS and RDS(on) Specified at Elevated Temperature
Mounting Information Provided for the D2PAK Package
Pb−Free Packages are Available
Typical Applications
PWM Motor Controls
Power Supplies
Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
100
Vdc
Drain−to−Source Voltage (RGS = 1.0 MW)
VDGR
100
Vdc
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tpv10 ms)
VGS
VGSM
"20
"40
Vdc
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Pulsed (Note 1)
ID
ID
IDM
52
40
156
Adc
Total Power Dissipation @ TA = 25°C
Derate above 25
°C
Total Power Dissipation @ TA = 25°C (Note 2)
PD
178
1.43
2.0
W
W/
°C
W
Operating and Storage Temperature Range
TJ, Tstg
−55 to
+150
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 50 Vdc, VGS = 10 Vdc,
IL(pk) = 40 A, L = 1.0 mH, RG = 25 W)
EAS
800
mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 2)
RqJC
RqJA
RqJA
0.7
62.5
50
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8in from case for 10 seconds
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Pulse Test: Pulse Width = 10
ms, Duty Cycle = 2%.
2. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu. Area 0.412 in2).
Device
Package
Shipping
ORDERING INFORMATION
N−Channel
D
S
G
NTB52N10
D2PAK
50 Units / Rail
NTB52N10T4
D2PAK
800 / Tape & Reel
http://onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
VDSS
RDS(ON) TYP
ID MAX
100 V
30 m
W @ 10 V
52 A
NTB52N10G
D2PAK
(Pb−Free)
50 Units / Rail
NTB52N10T4G
D2PAK
(Pb−Free)
800 / Tape & Reel
1
2
3
4
D2PAK
CASE 418B
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
NTB52N10
= Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
NTB
52N10G
AYWW
1
Gate
3
Source
4
Drain
2
Drain


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