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PZ3032I12BC Datasheet(PDF) 11 Page - NXP Semiconductors

Part # PZ3032I12BC
Description  32 macrocell CPLD
Download  14 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PZ3032I12BC Datasheet(HTML) 11 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
PZ3032
32 macrocell CPLD
1997 Feb 20
11
PIN DESCRIPTIONS
PZ3032 – 44-Pin Plastic Leaded Chip Carrier
1
6
7
17
18
28
29
39
40
Pin
Function
1
IN1
2
IN3
3VDD
4
I/O–A0–CK1
5
I/O–A1
6
I/O–A2
7
I/O–A3
8
I/O–A4
9
I/O–A5
10
GND
11
I/O–A6
12
I/O–A7
13
I/O–A8
14
I/O–A9
15
VDD
Pin
Function
16
I/O–A10
17
I/O–A11
18
I/O–A12
19
I/O–A13
20
I/O–A14
21
I/O–A15
22
GND
23
VDD
24
I/O–B15
25
I/O–B14
26
I/O–B13
27
I/O–B12
28
I/O–B11
29
I/O–B10
30
GND
Pin
Function
31
I/O–B9
32
I/O–B8
33
I/O–B7
34
I/O–B6
35
VDD
36
I/O–B5
37
I/O–B4
38
I/O–B3
39
I/O–B2
40
I/O–B1
41
I/O–B0
42
GND
43
IN0–CK0
44
IN2–gtsn
PLCC
SP00420
PZ3032 – 44-Pin Thin Quad Flat Package
44
1
11
12
22
23
33
34
Pin
Function
1
I/O–A3
2
I/O–A4
3
I/O–A5
4
GND
5
I/O–A6
6
I/O–A7
7
I/O–A8
8
I/O–A9
9VDD
10
I/O–A10
11
I/O–A11
12
I/O–A12
13
I/O–A13
14
I/O–A14
15
I/O–A15
Pin
Function
16
GND
17
VDD
18
I/O–B15
19
I/O–B14
20
I/O–B13
21
I/O–B12
22
I/O–B11
23
I/O–B10
24
GND
25
I/O–B9
26
I/O–B8
27
I/O–B7
28
I/O–B6
29
VDD
30
I/O–B5
Pin
Function
31
I/O–B4
32
I/O–B3
33
I/O–B2
34
I/O–B1
35
I/O–B0
36
GND
37
IN0/CK0
38
IN2–gtsn
39
IN1
40
IN3
41
VDD
42
I/O–A0–CK1
43
I/O–A1
44
I/O–A2
TQFP
SP00433
Package Thermal Characteristics
Philips Semiconductors uses the Temperature Sensitive Parameter
(TSP) method to test thermal resistance. This method meets
Mil-Std-883C Method 1012.1 and is described in Philips
1995 IC
Package Databook. Thermal resistance varies slightly as a function
of input power. As input power increases, thermal resistance
changes approximately 5% for a 100% change in power.
Figure 7 is a derating curve for the change in
ΘJA with airflow based
on wind tunnel measurements. It should be noted that the wind flow
dynamics are more complex and turbulent in actual applications
than in a wind tunnel. Also, the test boards used in the wind tunnel
contribute significantly to forced convection heat transfer, and may
not be similar to the actual circuit board, especially in size.
Package
ΘJA
44-pin PLCC
49.8
°C/W
44-pin TQFP
66.3
°C/W
0
10
20
30
40
50
012
3
4
5
PERCENTAGE
REDUCTION IN
ΘJA (%)
AIR FLOW (m/s)
PLCC/
QFP
SP00419A
Figure 7.
Average Effect of Airflow on
ΘJA


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