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PZ3032I12BC Datasheet(PDF) 11 Page - NXP Semiconductors |
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PZ3032I12BC Datasheet(HTML) 11 Page - NXP Semiconductors |
11 / 14 page Philips Semiconductors Product specification PZ3032 32 macrocell CPLD 1997 Feb 20 11 PIN DESCRIPTIONS PZ3032 – 44-Pin Plastic Leaded Chip Carrier 1 6 7 17 18 28 29 39 40 Pin Function 1 IN1 2 IN3 3VDD 4 I/O–A0–CK1 5 I/O–A1 6 I/O–A2 7 I/O–A3 8 I/O–A4 9 I/O–A5 10 GND 11 I/O–A6 12 I/O–A7 13 I/O–A8 14 I/O–A9 15 VDD Pin Function 16 I/O–A10 17 I/O–A11 18 I/O–A12 19 I/O–A13 20 I/O–A14 21 I/O–A15 22 GND 23 VDD 24 I/O–B15 25 I/O–B14 26 I/O–B13 27 I/O–B12 28 I/O–B11 29 I/O–B10 30 GND Pin Function 31 I/O–B9 32 I/O–B8 33 I/O–B7 34 I/O–B6 35 VDD 36 I/O–B5 37 I/O–B4 38 I/O–B3 39 I/O–B2 40 I/O–B1 41 I/O–B0 42 GND 43 IN0–CK0 44 IN2–gtsn PLCC SP00420 PZ3032 – 44-Pin Thin Quad Flat Package 44 1 11 12 22 23 33 34 Pin Function 1 I/O–A3 2 I/O–A4 3 I/O–A5 4 GND 5 I/O–A6 6 I/O–A7 7 I/O–A8 8 I/O–A9 9VDD 10 I/O–A10 11 I/O–A11 12 I/O–A12 13 I/O–A13 14 I/O–A14 15 I/O–A15 Pin Function 16 GND 17 VDD 18 I/O–B15 19 I/O–B14 20 I/O–B13 21 I/O–B12 22 I/O–B11 23 I/O–B10 24 GND 25 I/O–B9 26 I/O–B8 27 I/O–B7 28 I/O–B6 29 VDD 30 I/O–B5 Pin Function 31 I/O–B4 32 I/O–B3 33 I/O–B2 34 I/O–B1 35 I/O–B0 36 GND 37 IN0/CK0 38 IN2–gtsn 39 IN1 40 IN3 41 VDD 42 I/O–A0–CK1 43 I/O–A1 44 I/O–A2 TQFP SP00433 Package Thermal Characteristics Philips Semiconductors uses the Temperature Sensitive Parameter (TSP) method to test thermal resistance. This method meets Mil-Std-883C Method 1012.1 and is described in Philips 1995 IC Package Databook. Thermal resistance varies slightly as a function of input power. As input power increases, thermal resistance changes approximately 5% for a 100% change in power. Figure 7 is a derating curve for the change in ΘJA with airflow based on wind tunnel measurements. It should be noted that the wind flow dynamics are more complex and turbulent in actual applications than in a wind tunnel. Also, the test boards used in the wind tunnel contribute significantly to forced convection heat transfer, and may not be similar to the actual circuit board, especially in size. Package ΘJA 44-pin PLCC 49.8 °C/W 44-pin TQFP 66.3 °C/W 0 10 20 30 40 50 012 3 4 5 PERCENTAGE REDUCTION IN ΘJA (%) AIR FLOW (m/s) PLCC/ QFP SP00419A Figure 7. Average Effect of Airflow on ΘJA |
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