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FMS6502MTC24 Datasheet(PDF) 11 Page - Fairchild Semiconductor |
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FMS6502MTC24 Datasheet(HTML) 11 Page - Fairchild Semiconductor |
11 / 13 page © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FMS6502 Rev. 1.0.0 11 Layout Considerations General layout and supply bypassing play a major role in high-frequency performance and thermal characteristics. Fairchild offers a demonstration board to guide layout and aid device evaluation. The demo board is a four- layer board with full power and ground planes. Following this layout configuration provides optimum performance and thermal characteristics for the device. For the best results, follow the steps and recommended routing rules listed below. Recommended Routing/Layout Rules • Do not run analog and digital signals in parallel. • Use separate analog and digital power planes to sup- ply power. • Traces should run on top of the ground plane at all times. • No trace should run over ground/power splits. • Avoid routing at 90-degree angles. • Minimize clock and video data trace length differ- ences. • Include 10µF and 0.1µF ceramic power supply bypass capacitors. • Place the 0.1µF capacitor within 0.1 inches of the device power pin. • Place the 10µF capacitor within 0.75 inches of the device power pin. • For multilayer boards, use a large ground plane to help dissipate heat. • For two-layer boards, use a ground plane that extends beyond the device body by at least 0.5 inches on all sides. Include a metal paddle under the device on the top layer. • Minimize all trace lengths to reduce series inductance. Thermal Considerations Since the interior of most systems, such as set-top boxes, TVs, and DVD players, are at +70ºC; consider- ation must be given to providing an adequate heat sink for the device package for maximum heat dissipation. When designing a system board, determine how much power each device dissipates. Ensure that devices of high power are not placed in the same location, such as directly above (top plane) or below (bottom plane) each other on the PCB. PCB Thermal Layout Considerations • Understand the system power requirements and envi- ronmental conditions. • Maximize thermal performance of the PCB. • Consider using 70µm of copper for high-power designs. • Make the PCB as thin as possible by reducing FR4 thickness. • Use vias in power pad to tie adjacent layers together. • Remember that baseline temperature is a function of board area, not copper thickness. • Modeling techniques can provide a first-order approxi- mation. Power Dissipation Worst-case, additional die power due to DC loading can be estimated at Vcc 2/4R load per output channel. This assumes a constant DC output voltage of Vcc/2. For 5V Vcc with a dual DC video load, add 25/(4*75) = 83mW, per channel. Applications for the FMS6502 Video Switch Matrix The increased demand for consumer multimedia sys- tems has created a large challenge for system designers to provide cost-effective solutions to capitalize on the growth potential in graphics display technologies. These applications require cost-effective video switching and fil- tering solutions to deploy high-quality display technolo- gies rapidly and effectively to the target audience. Areas of specific interest include HDTV, media centers, and automotive infotainment (such as navigation, in-cabin entertainment, and back-up cameras). In all cases, the advantages the integrated video switch matrix provides are high-quality video switching specific to the applica- tion, as well as video input clamps and on-chip, low- impedance output cable drivers with switchable gain. Generally the largest application for a video switch is for the front-end of an HDTV. This is used to take multiple inputs and route them to their appropriate signal paths (main picture and picture-in-picture, or PiP). These are normally routed into ADCs that are followed by decod- ers. Technologies for HDTV include LCD, plasma, and CRT, which have similar analog switching circuitry. VIPDEMOTM Control Software The FMS6502 is configured via an I2C-compatible digital interface. To facilitate demonstration, Fairchild Semicon- ductor had developed the VIPDEMOTM GUI-based con- trol software to write to the FMS6502 register map. This software is included in the FMS6502DEMO kit. A parallel port I2C adapter and an interface cable to connect to the demo board are also included. Besides using the full FMS6502 interface, the VIPDEMOTM can also be used to control single register read and writes for I2C. |
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