2

IR2106/IR21064/IR2107/IR21074

www.irf.com

Symbol

Definition

Min.

Max.

Units

High side floating absolute voltage

-0.3

625

High side floating supply offset voltage

High side floating output voltage

Low side and logic fixed supply voltage

-0.3

25

Low side output voltage

-0.3

Logic input voltage (HIN & LIN - IR2106/IR21064)

(HIN & LIN - IR2107/IR21074)

Logic ground (IR21064/IR21074 only)

Allowable offset supply voltage transient

—

50

V/ns

(8 lead PDIP)

—

1.0

(8 lead SOIC)

—

0.625

(14 lead PDIP)

—

1.6

(14 lead SOIC)

—

1.0

Thermal resistance, junction to ambient

(8 lead PDIP)

—

125

(8 lead SOIC)

—

200

(14 lead PDIP)

—

75

(14 lead SOIC)

—

120

Junction temperature

—

150

Storage temperature

-50

150

Lead temperature (soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured

under board mounted and still air conditions.

VB

High side floating supply absolute voltage

High side floating supply offset voltage

Note 1

600

High side floating output voltage

Low side and logic fixed supply voltage

10

20

Low side output voltage

0

Logic input voltage (HIN & LIN - IR2106/IR21064)

(HIN & LIN - IR2107/IR21074)

Logic ground (IR21064/IR21074 only)

-5

5

Ambient temperature

-40

125

°C

V

V

Symbol

Definition

Min.

Max.

Units

Recommended Operating Conditions

The Input/Output logic timing diagram is shown in figure 1. For proper operation the device should be used within the

°C

°C/W

W