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MAX3786UTJ Datasheet(PDF) 6 Page - Maxim Integrated Products |
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MAX3786UTJ Datasheet(HTML) 6 Page - Maxim Integrated Products |
6 / 10 page that OOB signaling is transmitted through the MAX3786 (see Table 1). The time for the LOS circuit to detect an inactive input and disable the associated output, or detect an active input and enable the output, is less than 5ns. Equalization and Preemphasis High-speed inputs IN0 and IN1 have integrated equal- ization, and high-speed outputs OUT0 and OUT1 have integrated PE to mitigate the effects of intersymbol interference in an FR-4 transmission line signal path. These circuits provide EQ or PE that matches the typi- cal path loss of a 20in, 6-mil FR-4 differential stripline. Four active-low LVCMOS inputs, EQ0EN, EQ1EN, PE0EN, and PE1EN are provided to enable EQ and PE independently. All four control lines are internally pulled high through 40k Ω resistors (see the Functional Diagram). EQ and PE should be enabled when the total path loss exceeds approximately 2.5dB. Input Terminations All high-speed inputs accept current-mode logic (CML) and are SATA compatible. The inputs contain internal 100 Ω differential termination, and must be AC-coupled to the controller IC and SATA-compatible disk drive for proper operation. Two pins (CM0 and CM1) provide access to the IN0 and IN1 common-mode points. CM0 and CM1 are nor- mally left unconnected; however, a capacitor up to 1.0µF can be connected from each CM_ pin to VCC, providing a low-impedance AC common-mode path to VCC (see Figure 1). Output Terminations The MAX3786 uses CML for its high-speed outputs. They are SATA compatible and provide 50 Ω termina- tions to VCC (see Figure 2). The high-speed outputs must be AC-coupled to the controller IC and SATA- compatible disk drive for proper operation. Applications Information Hot Swap The MAX3786 is designed so that arbitrary sequencing of VCC and I/O signals during startup does not affect operation of the part. Exposed-Pad Package The MAX3786 is available in a 5mm ✕ 5mm, 32-pin thin QFN package with EP for signal integrity and place- ment flexibility. The exposed pad provides thermal and electrical connectivity to the IC, and must be soldered to a high-frequency ground plane. It is recommended to use at least nine vias to connect the ground pad underneath the 32-lead thin QFN package to the PC board ground plane. Layout Considerations Use controlled-impedance transmission lines to inter- face with the MAX3786 high-speed inputs and outputs. Power-supply decoupling capacitors should be placed as close as possible to the VCC pins. 1.5Gbps Serial ATA-Compatible Mux/Buffer with Loopback and Equalization 6 _______________________________________________________________________________________ MAX3786 VCC VCC VCC IN_+ CM_ IN_- 50 Ω 50 Ω 2pF 0.2mA 1.6k Ω Figure 1. Input Structure (IN0, IN1) 50 Ω 50 Ω VCC OUT_+ OUT_- MAX3786 Figure 2. Output Structure (OUT0, OUT1) |
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