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MT58L128L18F Datasheet(PDF) 9 Page - Micron Technology |
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MT58L128L18F Datasheet(HTML) 9 Page - Micron Technology |
9 / 24 page 9 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice. MT58L128L18F_2.p65 – Rev. 6/01 ©2000, Micron Technology, Inc. 2Mb: 128K x 18, 64K x 32/36 FLOW-THROUGH SYNCBURST SRAM ABSOLUTE MAXIMUM RATINGS* Voltage on VDD Supply Relative to VSS .................................... -0.5V to +4.6V Voltage on VDDQ Supply Relative to VSS .................................... -0.5V to +4.6V VIN ............................................... -0.5V to VDDQ + 0.5V Storage Temperature (plastic) ............ -55°C to +150°C Junction Temperature** .................................... +150°C Short Circuit Output Current ........................... 100mA *Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. **Maximum junction temperature depends upon pack- age type, cycle time, loading, ambient temperature and airflow. See Micron Technical Note TN-05-14 for more information. 3.3V I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS (0°C ≤ T A ≤ +70°C; VDD, VDDQ = +3.3V +0.3V/-0.165V unless otherwise noted) DESCRIPTION CONDITIONS SYMBOL MIN MAX UNITS NOTES Input High (Logic 1) Voltage VIH 2.0 VDD + 0.3 V 1, 2 Input Low (Logic 0) Voltage VIL -0.3 0.8 V 1, 2 Input Leakage Current 0V ≤ VIN ≤ VDD ILI -1.0 1.0 µA 3 Output Leakage Current Output(s) disabled, ILO -1.0 1.0 µA 0V ≤ VIN ≤ VDD Output High Voltage IOH = -4.0mA VOH 2.4 – V 1, 4 Output Low Voltage IOL = 8.0mA VOL – 0.4 V 1, 4 Supply Voltage VDD 3.135 3.6 V 1 Isolated Output Buffer Supply VDDQ 3.135 VDD V 1, 5 NOTE: 1. All voltages referenced to VSS (GND). 2. Overshoot: VIH ≤ +4.6V for t ≤ tKC/2 for I ≤ 20mA Undershoot: VIL ≥ -0.7V for t ≤ tKC/2 for I ≤ 20mA Power-up: VIH ≤ +3.6V and VDD ≤ 3.135V for t ≤ 200ms 3. MODE pin has an internal pull-up, and input leakage = ±10µA. 4. The load used for VOH, VOL testing is shown in Figure 2 for 3.3V I/O and Figure 4 for 2.5V I/O. AC load current is higher than the stated DC values. AC I/O curves are available upon request. 5. VDDQ should never exceed VDD. VDD and VDDQ can be connected together for 3.3V I/O. 2.5V I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS (0°C ≤ T A ≤ +70°C; VDD = +3.3V +0.3V/-0.165V; VDDQ = +2.5V +0.4V/-0.125V unless otherwise noted) DESCRIPTION CONDITIONS SYMBOL MIN MAX UNITS NOTES Input High (Logic 1) Voltage Data bus (DQx) VIHQ 1.7 VDDQ + 0.3 V 1, 2 Inputs VIH 1.7 VDD + 0.3 V 1, 2 Input Low (Logic 0) Voltage VIL -0.3 0.7 V 1, 2 Input Leakage Current 0V ≤ VIN ≤ VDD ILI -1.0 1.0 µA 3 Output Leakage Current Output(s) disabled, ILO -1.0 1.0 µA 0V ≤ VIN ≤ VDDQ (DQx) Output High Voltage IOH = -2.0mA VOH 1.7 – V 1, 4 IOH = -1.0mA VOH 2.0 – V 1, 4 Output Low Voltage IOL = 2.0mA VOL – 0.7 V 1, 4 IOL = 1.0mA VOL – 0.4 V 1, 4 Supply Voltage VDD 3.135 3.6 V 1 Isolated Output Buffer Supply VDDQ 2.375 2.9 V 1 |
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