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MT58L64L36FT-8.5 Datasheet(PDF) 1 Page - Micron Technology

Part # MT58L64L36FT-8.5
Description  2Mb: 128K x 18, 64K x 32/36 FLOW-THROUGH SYNCBURST SRAM
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Manufacturer  MICRON [Micron Technology]
Direct Link  http://www.micron.com
Logo MICRON - Micron Technology

MT58L64L36FT-8.5 Datasheet(HTML) 1 Page - Micron Technology

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2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT58L128L18F_2.p65 – Rev. 6/01
©2000, Micron Technology, Inc.
2Mb: 128K x 18, 64K x 32/36
FLOW-THROUGH SYNCBURST SRAM
2Mb SYNCBURST
SRAM
FEATURES
• Fast clock and OE# access times
• Single +3.3V +0.3V/-0.165V power supply (VDD)
• Separate +3.3V or +2.5V isolated output buffer
supply (VDDQ)
• SNOOZE MODE for reduced-power standby
• Common data inputs and data outputs
• Individual BYTE WRITE control and GLOBAL
WRITE
• Three chip enables for simple depth expansion and
address pipelining
• Clock-controlled and registered addresses, data
I/Os and control signals
• Internally self-timed WRITE cycle
• Burst control pin (interleaved or linear burst)
• Automatic power-down
• 100-pin TQFP package
• Low capacitive bus loading
• x18, x32, and x36 versions available
OPTIONS
MARKING
• Timing (Access/Cycle/MHz)
6.8ns/8.0ns/125 MHz
-6.8
7.5ns/8.8ns/113 MHz
-7.5
8.5ns/10ns/100 MHz
-8.5
10ns/15ns/66 MHz
-10
• Configurations
3.3V I/O
128K x 18
MT58L128L18F
64K x 32
MT58L64L32F
64K x 36
MT58L64L36F
2.5V I/O
128K x 18
MT58L128V18F
64K x 32
MT58L64V32F
64K x 36
MT58L64V36F
• Packages
100-pin TQFP
T
• Operating Temperature Range
Commercial (0°C to +70°C)
None
Part Number Example:
MT58L64L36FT-8.5
MT58L128L18F, MT58L64L32F,
MT58L64L36F; MT58L128V18F,
MT58L64V32F, MT58L64V36F
3.3V VDD, 3.3V or 2.5V I/O, Flow-Through
GENERAL DESCRIPTION
The Micron® SyncBurstSRAM family employs
high-speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
Micron’s 2Mb SyncBurst SRAMs integrate a 128K x
18, 64K x 32, or 64K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. All synchronous inputs pass through registers
controlled by a positive-edge-triggered single clock
input (CLK). The synchronous inputs include all ad-
dresses, all data inputs, active LOW chip enable (CE#),
two additional chip enables for easy depth expansion
(CE2, CE2#), burst control inputs (ADSC#, ADSP#,
ADV#), byte write enables (BWx#) and global write
(GW#).
Asynchronous inputs include the output enable
(OE#), snooze enable (ZZ) and clock (CLK). There is also
a burst mode pin (MODE) that selects between inter-
leaved and linear burst modes. The data-out (Q), en-
abled by OE#, is also asynchronous. WRITE cycles can
be from one to two bytes wide (x18) or from one to four
bytes wide (x32/x36), as controlled by the write control
inputs.
Burst operation can be initiated with either address
status processor (ADSP#) or address status controller
(ADSC#) input pins. Subsequent burst addresses can be
internally generated as controlled by the burst advance
pin (ADV#).
**JEDEC-standard MS-026 BHA (LQFP).
100-Pin TQFP**


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