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RXE017K Datasheet(PDF) 7 Page - List of Unclassifed Manufacturers

Part # RXE017K
Description  PolySwitch RXE device
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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4
Raychem Circuit Protection Devices
RXE Devices
171
RXE Product Data
Now that you have selected your RXE device, please review the
device’s characteristics in this section to verify that the device will
perform as required.
Electrical characteristics (20°C)
Max. time
Initial resistance
Post-trip resistance
Part
IH
IT
to trip (s)
Pd
R min.
R max.
R1 max .
Number
(A)
(A)
at 5 x IH
(W)
(
Ω )( Ω )( Ω )
RXE010
0.10
0.20
4.0
0.38
2.50
4.50
7.50
RXE017
0.17
0.34
3.0
0.48
3.30
5.21
8.00
RXE020
0.20
0.40
2.2
0.41
1.83
2.75
4.40
RXE025
0.25
0.50
2.5
0.45
1.25
1.95
3.00
RXE030
0.30
0.60
3.0
0.49
0.88
1.33
2.10
RXE040
0.40
0.80
3.8
0.56
0.55
0.86
1.29
RXE050
0.50
1.00
4.0
0.77
0.50
0.77
1.17
RXE065
0.65
1.30
5.3
0.88
0.31
0.48
0.72
RXE075
0.75
1.50
6.3
0.92
0.25
0.40
0.60
RXE090
0.90
1.80
7.2
0.99
0.20
0.31
0.47
RXE110
1.10
2.20
8.2
1.50
0.15
0.25
0.38
RXE135
1.35
2.70
9.6
1.70
0.12
0.19
0.30
RXE160
1.60
3.20
11.4
1.90
0.09
0.14
0.22
RXE185
1.85
3.70
12.6
2.10
0.08
0.12
0.19
RXE250
2.50
5.00
15.6
2.50
0.05
0.08
0.13
RXE300
3.00
6.00
19.8
2.80
0.04
0.06
0.10
RXE375
3.75
7.50
24.0
3.20
0.03
0.05
0.08
IH = Hold current—maximum current at which the device will not trip at 20°C.
IT = Trip current—minimum current at which the device will always trip at 20°C.
Pd = Typical power dissipation—typical amount of power dissipated by the device when in tripped state in 20°C still air.
R min. = Minimum device resistance at 20°C prior to tripping.
R max. = Maximum device resistance at 20°C prior to tripping.
R1 max. = Maximum device resistance at 20°C measured 1 hour post trip.
Physical characteristics
Lead material
RXE010: Tin coated nickel-copper alloy, 24 AWG,
∅ 0.51 mm/0.020 in
RXE017–040: Tin/lead-plated copper-clad steel, 24 AWG,
∅ 0.51 mm/0.020 in
RXE050–090: Tin/lead-plated copper, 24 AWG,
∅ 0.51 mm/0.020 in
RXE110–375: Tin-plated copper, 20 AWG,
∅ 0.81 mm/0.032 in
Soldering characteristics
Solderability per MIL-STD-202, Method 208E
Solder heat withstand per MIL-STD-202, Method 210, Condition B
Insulating material
Cured, flame-retardant epoxy polymer; meets UL 94V-O
requirements
RXE
Radial Leaded
Note: Devices are not designed to be placed through a reflow process.
RXE(7)
1/15/99 11:44 AM
Page 171


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