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V2.4 Dec 2006
Data Sheet
Ag9000-S
Power-Over-Ethernet Module
One simple method for drawing some of the heat away from the Ag9000-S is shown in
Figure 9. Power planes connected to the +VDC and GND pins of the Ag9000-S can be
used to draw heat away from the DC/DC converter via the output pins.
These power planes must be on the outer layers of the PCB and the Ag9000-S must not
be fitted into a socket.
Output
Voltage
VA & VB
Inputs
R2
R1
R3
_
+
ADJ
CLASS
C1
Ag9000-S
1
+VDC
GND
Power
Plane
Figure 9: Power Plane Heatsink for Ag9000-S
Figure 10, Figure 11 & Figure 12 show the maximum ambient temperature under different
load conditions. These figure have been recorded in a sealed enclosure (in still air) using a
heater element to elevate the ambient temperature (within the enclosure).
-20
-10
0
10
203040
506070
1
4
2
5
3
Ambient Temperaure (°C)
6
Figure 10: Ag9033-S Operating Profile
© Silver Telecom 2006
11
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