MULTILAYER

Ceramic Chip Inductor

8430 Series

ENVIRONMENTAL CHARACTERISTICS

Item

Specification

Test Methods

1Bending Strength

Appearance: No damage

Test device shall be soldered on the substrate

Substrate Dimension: 95x23x1.5mm

Deflection: 2.0mm

Keeping Time: 30sec

2Resistance to

Soldering Heat

Appearance: No damage

L change: within

±10%

Q change: within

±20%

Pre-heating: 120

±20 ˚C, 1min

Solder Temperature: 260

±10 ˚C Immersion Time: 3±1sec

Measured after exposure in the room condition for 24hrs

3Solderability

The electrodes shall be at least

75% covered with new solder

coating

L change: within

±10%

Q change: within

±20%

Pre-heating: 120

±20 ˚C, 1min

Solder Temperature: 230

±10 ˚C

Immersion Time: 3

±1sec

4Temperature Cycle

One Cycle:

One cycle/step 1: 100

±5 ˚C for 30±1min

step 2: -40

±3 ˚C for 30±1min

Total: 100cycles

Measured after exposure in the room condition for 24hrs

5Humidity Resistance

Temperature: 40

±2 ˚C

Relative Humidity: 90~95%

Time: 1000hrs

Measured after exposure in the room condition for 24hrs

6Heat Life

Temperature: 85

±2 ˚C

Applied Current: Rated Current

Time: 1000hrs

Measured after exposure in the room condition for 24hrs

7Cold Resistance

Temperature: -40

±5 ˚C

Time: 1000hrs

Measured after exposure in the room condition for 24hrs

An ISO 9001 Registered Company

229 Colonnade Road, Ottawa, Ontario, Canada K2E 7K3

Page 4 of 4

PACKAGING

Unit: pcs

Packaging

Series

pcs/wheel

8430-03

4,000

8430-02

10,000

Packaging Quanitity

Reel Dimensions

Unit: mm

Series

A

B

C

D

8430-03

178

60

12

1.5

8430-02

178

60

12

1.5

Emboss Plastic Tape Specifications

Unit: mm

Series

A

B

WP

F

K

8430-03

1.1

1.9

0.95

8

4

3.5

0.95

8430-02

0.65

1.15

0.6

8

2

3.5

0.6