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MPC5200BV400 Datasheet(PDF) 9 Page - Freescale Semiconductor, Inc |
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MPC5200BV400 Datasheet(HTML) 9 Page - Freescale Semiconductor, Inc |
9 / 80 page Electrical and Thermal Characteristics MPC5200 Data Sheet, Rev. 4 Freescale Semiconductor 9 3.1.4 Electrostatic Discharge CAUTION This device contains circuitry that protects against damage due to high-static voltage or electrical fields. However, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages. Operational reliability is enhanced if unused inputs are tied to an appropriate logic voltage level (i.e., either GND or VCC). Table 7 gives package thermal characteristics for this device. 3.1.5 Power Dissipation Power dissipation of the MPC5200 is caused by 3 different components: the dissipation of the internal or core digital logic (supplied by VDD_CORE), the dissipation of the analog circuitry (supplied by SYS_PLL_AVDD and CORE_PLL_AVDD) and the dissipation of the IO logic (supplied by VDD_IO_MEM and VDD_IO). Table 6 details typical measured core and analog power dissipation figures for a range of operating modes. However, the dissipation due to the switching of the IO pins can not be given in general, but must be calculated by the user for each application case using the following formula DRV8_OD VDD_IO = 3.3V - 8 mA D3.27 DRV16_MEM VDD_IO_MEM = 3.3V 16 16 mA D3.28 DRV16_MEM VDD_IO_MEM = 2.5V 16 16 mA D3.29 PCI VDD_IO = 3.3V 16 16 mA D3.30 Table 5. ESD and Latch-Up Protection Characteristics Sym Rating Min Max Unit SpecID VHBM Human Body Model (HBM)—JEDEC JESD22-A114-B 2000 — V D4.1 VMM Machine Model (MM)—JEDEC JESD22-A115 200 — V D4.2 VCDM Charge Device Model (CDM)—JEDEC JESD22-C101 500 — V D4.3 ILAT Latch-up Current at TA=85 oC positive negative +100 -100 —mA D4.4 ILAT Latch-up Current at TA=27 oC positive negative +200 -200 —mA D4.5 Table 4. Drive Capability of MPC5200 Output Pins (continued) Driver Type Supply Voltage IOH IOL Unit SpecID PIO PIOint N M ∑ + CVDD_IO 2 f × × × = |
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