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SPC5200CBV400 Datasheet(PDF) 11 Page - Freescale Semiconductor, Inc |
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SPC5200CBV400 Datasheet(HTML) 11 Page - Freescale Semiconductor, Inc |
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11 / 80 page  Electrical and Thermal Characteristics MPC5200 Data Sheet, Rev. 4 Freescale Semiconductor 11 3.1.6 Thermal Characteristics 3.1.7 Heat Dissipation An estimation of the chip-junction temperature, TJ, can be obtained from the following equation: TJ =TA+(RθJA × PD) Eqn. 1 where: TA = ambient temperature for the package (°C) RθJA = junction to ambient thermal resistance (°C/W) PD = power dissipation in package (W) The junction to ambient thermal resistance is an industry standard value, which provides a quick and easy estimation of thermal performance. Unfortunately, there are two values in common usage: the value determined on a single layer board, and the value obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which value is correct depends on the power dissipated by other components on the board. The value obtained on a single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal planes is usually appropriate if the board has low power dissipation and the components are well separated. Table 7. Thermal Resistance Data Rating Value Unit Notes SpecID Junction to Ambient Natural Convection Single layer board (1s) RθJA 30 °C/W 1,2 NOTES: 1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. D6.1 Junction to Ambient Natural Convection Four layer board (2s2p) RθJMA 22 °C/W 1,3 3 Per JEDEC JESD51-6 with the board horizontal. D6.2 Junction to Ambient (@200 ft/min) Single layer board (1s) RθJMA 24 °C/W 1,3 D6.3 Junction to Ambient (@200 ft/min) Four layer board (2s2p) RθJMA 19 °C/W 1,3 D6.4 Junction to Board RθJB 14 °C/W 4 4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. D6.5 Junction to Case RθJC 8°C/W 5 5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). D6.6 Junction to Package Top Natural Convection Ψ JT 2°C/W 6 6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. D6.7 |
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