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K4Y50044UC-JCA2 Datasheet(PDF) 4 Page - Samsung semiconductor

Part # K4Y50044UC-JCA2
Description  512Mbit XDR TM DRAM(C-die)
Download  76 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4Y50044UC-JCA2 Datasheet(HTML) 4 Page - Samsung semiconductor

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Rev. 1.1 August 2006
K4Y50024UC
XDRTM DRAM
K4Y50044UC
K4Y50084UC
K4Y50164UC
4 of 76
Organization
Bandwidth (1/tBIT)
a
a.Data rate measured in Mbit/s per DQ differential pair. See “Timing Conditions” on page 58 and “ Timing Characteristics” on page 60.
Note that tBIT=tCYCLE/8
Latency(tRAC)
b
b.Read access time tRAC (= tRCD-R+tCAC) measured in ns. See “Timing Parameters” on page 61.
Binc
c.Timing parameter bin. See “Timing Parameters” on page 61. This is a measure of the number of interleaved read transactions needed
for maximum efficiency (the value Ceiling(tRC-R/tRR-D). For bin A, tRC-R/tRR-D=4, and for bin B, tRC-R/tRR-D=5 for bin C, tRC-R/tRR-D =6.
Part Number
32Mx16
2400
36
A
K4Y50164UC-JCA2
3200
35
B
K4Y50164UC-JCB3
4000
28
C
K4Y50164UC-JCC4
64Mx8
2400
36
A
K4Y50084UC-JCA2
3200
35
B
K4Y50084UC-JCB3
4000
28
C
K4Y50084UC-JCC4
128Mx4
2400
36
A
K4Y50044UC-JCA2
3200
35
B
K4Y50044UC-JCB3
4000
28
C
K4Y50044UC-JCC4
256Mx2
2400
36
A
K4Y50024UC-JCA2
3200
35
B
K4Y50024UC-JCB3
4000
28
C
K4Y50024UC-JCC4
2.0 Key Timing Parameters/Part Numbers


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