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K7Q163664B Datasheet(PDF) 5 Page - Samsung semiconductor

Part # K7Q163664B
Description  512Kx36 & 1Mx18 QDR TM b4 SRAM
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

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512Kx36 & 1Mx18 QDRTM b4 SRAM
- 5 -
Rev 1.0
Mar. 2004
K7Q163664B
K7Q161864B
The K7Q163664B and K7Q161864B are 18,874,368-bits QDR(Quad Data Rate) Synchronous Pipelined Burst SRAMs.
They are organized as 524,288 words by 36bits for K7Q163654B and 1,048,576 words by 18 bits for K7Q161864B.
The QDR operation is possible by supporting DDR read and write operations through separate data output and input ports
with the same cycle. Memory bandwidth is maxmized as data can be transfered into sram
on every rising edge of K and K, and transfered out of sram on every rising edge of C and C.
And totally independent read and write ports eliminate the need for high speed bus turn around.
Address for read and write are latched on alternate rising edges of the input clock K.
Data inputs, and all control signals are synchronized to the input clock ( K or K ).
Normally data outputs are synchronized to output clocks ( C and C ), but when C and C are tied high,
the data outputs are synchronized to the input clocks ( K and K ).
Common address bus is used to access address both for read and write operations.
The internal burst counter is fiexd to 4-bit sequential for both read and write operations, reguiring tow full clock bus cycles.
Any request that attempts to interrupt a burst operation in progress is ignored.
Synchronous pipeline read and late write enable high speed operations.
Simple depth expansion is accomplished by using R and W for port selection.
Byte write operation is supported with BW0 and BW1 ( BW2 and BW3 ) pins.
IEEE 1149.1 serial boundary scan (JTAG) simplifies monitoring package pads attachment status with system.
The K7Q163664B and K7Q161864B are implemented with SAMSUNG's high performance 6T CMOS technology and is available
in 165pin FBGA packages. Multiple power and ground pins minimize ground bounce.
GENERAL DESCRIPTION
Read Operations
Read cycles are initiated by activating R at the rising edge of the positive input clock K.
Address is presented and stored in the read address register synchronized with K clock.
For 4-bit burst DDR operation, it will access four 36-bit or 18-bit data words with each read command.
The first pipelined data is transfered out of the device triggered by C clock following next K clock rising edge.
Next burst data is triggered by the rising edge of following C clock rising edge.
The process continues until all four data are transfered.
Continuous read operations are initiated with K clock rising edge.
And pipelined data are transferred out of device on every rising edge of both C and C clocks.
In case C and C tied to high, output data are triggered by K and K instead of C and C.
When the R is disabled after a read operation, the K7Q163664B and K7Q161864B will first complete burst read operation
before entering into deselect mode at the next K clock rising edge.
Then output drivers disabled automatically to high impedance state.
The following power-up supply voltage application is recommended: VSS, VDD, VDDQ, VREF, then VIN. VDD and VDDQ can be applied
simultaneously, as long as VDDQ does not exceed VDD by more than 0.5V during power-up. The following power-down supply voltage
removal sequence is recommended: VIN, VREF, VDDQ, VDD, VSS. VDD and VDDQ can be removed simultaneously, as long as VDDQ
does not exceed VDD by more than 0.5V during power-down.
Power-Up/Power-Down Supply Voltage Sequencing


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