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MAS1175 Datasheet(PDF) 6 Page - Micro Analog systems |
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MAS1175 Datasheet(HTML) 6 Page - Micro Analog systems |
6 / 9 page 6 (9) DA1175.008 13 July, 2006 SOLDERING INFORMATION N For Sn/Pb MSOP-10 Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 2*220°C Maximum Temperature 240°C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% N For Pb Free, RoHS Compliant MSOP-10 Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 Maximum Temperature 260°C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org Lead Finish Solder plate 7.62 - 25.4 µm, material Matte Tin |
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