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K4M511633C-RBF1H Datasheet(PDF) 1 Page - Samsung semiconductor

Part # K4M511633C-RBF1H
Description  8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4M511633C-RBF1H Datasheet(HTML) 1 Page - Samsung semiconductor

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K4M511633C - R(B)N/G/L/F
March 2006
1
Mobile SDRAM
• 3.0V & 3.3V power supply.
• LVCMOS compatible with multiplexed address.
• Four banks operation.
• MRS cycle with address key programs.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
• EMRS cycle with address key programs.
• All inputs are sampled at the positive going edge of the system
clock
• Burst read single-bit write operation.
• Special Function Support.
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
-. DS (Driver Strength)
• DQM for masking.
• Auto refresh.
• 64ms refresh period (8K cycle).
• Commercial Temperature Operation (-25
°C ~ 70°C).
• Extended Temperature Operation (-25
°C ~ 85°C).
• 54Balls FBGA ( -RXXX -Pb, -BXXX -Pb Free).
FEATURES
The K4M511633C is 536,870,912 bits synchronous high data
rate Dynamic RAM organized as 4 x 8,388,608 words by 16 bits,
fabricated with SAMSUNG's high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock and I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst length and programmable latencies allow the same device
to be useful for a variety of high bandwidth, high performance
memory system applications.
GENERAL DESCRIPTION
8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PRO-
VIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could
result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or pro-
visions may apply.
Address configuration
Organization
Bank
Row
Column Address
32M x16
BA0,BA1
A0 - A12
A0 - A9
ORDERING INFORMATION
- R(B)N/G : Low Power, Extended Temperature(-25
°C ~ 85°C)
- R(B)L/F : Low Power, Commercial Temperature(-25
°C ~ 70°C)
NOTES :
1. In case of 40MHz Frequency, CL1 can be supported.
Part No.
Max Freq.
Interface
Package
K4M511633C-R(B)N/G/L/F75
133MHz(CL3), 111MHz(CL2)
LVCMOS
54 FBGA Pb
(Pb Free)
K4M511633C-R(B)N/G/L/F1H
111MHz(CL2)
K4M511633C-R(B)N/G/L/F1L
111MHz(CL=3)*1, 83MHz(CL2)


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