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MAS9179 Datasheet(PDF) 7 Page - Micro Analog systems |
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MAS9179 Datasheet(HTML) 7 Page - Micro Analog systems |
7 / 9 page 7 (9) DA9179.002 19 May, 2005 TYPICAL APPLICATION (Continued) Note 1: Crystals The crystals as well as ferrite antenna frequencies are chosen according to the time-signal system (Table 2). The crystal shunt capacitance C0 should be matched as well as possible with the internal shunt capacitance compensation capacitor CC of MAS9179. See Compensation Capacitance Options on table 3. Table 2 Time-Signal System Frequencies Time-Signal System Location Antenna Frequency Recommended Crystal Frequency DCF77 Germany 77.5 kHz 77.503 kHz HGB Switzerland 75 kHz 75.003 kHz MSF United Kingdom 60 kHz 60.003 kHz WWVB USA 60 kHz 60.003 kHz JJY Japan 40 kHz and 60 kHz 40.003 kHz and 60.003 kHz BPC China 68.5 kHz 68.505 kHz Table 3 Compensation Capacitance Options Device CC Crystal Description MAS9179A1 0.75 pF For low C0 crystal MAS9179A2 0.875 pF For low C0 crystal MAS9179A3 1.25 pF For high C0 crystal MAS9179A4 1.5 pF For high C0 crystal It should be noted that grounded crystal package has reduced shunt capacitance. This value is about 85% of floating crystal shunt capacitance. For example crystal with 1pF floating package shunt capacitance can have 0.85pF grounded package shunt capacitance. PCB traces of crystal and external compensation capacitance should be kept at minimum to minimize additional parasitic capacitance which can cause capacitance mismatching. Highest frequency crystal is connected to crystal output pin 1 (QO1). Medium frequency crystal is connected to crystal output pin 2 (QO2). Lowest frequency crystal is connected to crystal output pin 3 (QO3). The other pin of each crystal is connected to common crystal input pin QI. Table 4 below presents some crystal manufacturers having suitable crystals for timesignal receiver application. Table 4. Crystal Manufacturers and Crystal Types in Alphaphetical Order for Timesignal Receiver Application Manufacturer Crystal Type Dimensions Web Link Citizen CFV-206 ø 2.0 x 6.0 http://www.citizen.co.jp/tokuhan/quartz/ Epson C-2-Type C-4-Type ø 1.5 x 5.0 ø 2.0 x 6.0 http://www.epsondevice.com/e/ KDS Daishinku DT-261 ø 2.0 x 6.0 http://www.kdsj.co.jp/english.html Microcrystal MX1V-L2N MX1V-T1K ø 2.0 x 6.0 ø 2.0 x 8.1 http://www.microcrystal.com/ Seiko Instruments VTC-120 ø 1.2 x 4.7 http://speed.sii.co.jp/pub/compo/quartz/topE.jsp Note 2: AGC Capacitor The AGC and DEC capacitors must have low leakage currents due to very small signal currents through the capacitors. The insulation resistance of these capacitors should be at minimum 100 M Ω. Also probes with at least 100 M Ω impedance should be used for voltage probing of AGC and DEC pins. DEC capacitor can be low leakage chip capacitor. |
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