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BUK113-50DL Datasheet(PDF) 4 Page - NXP Semiconductors |
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BUK113-50DL Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 6 page Philips Semiconductors Objective specification PowerMOS transistor BUK113-50DL Logic level TOPFET MOUNTING INSTRUCTIONS Dimensions in mm. Fig.2. Soldering pattern for surface mounting. PRINTED CIRCUIT BOARD Dimensions in mm. Fig.3. PCB for thermal resistance and power rating. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick). 36 60 9 10 4.6 18 4.5 7 15 50 3.8 min 6.3 2.3 4.6 1.5 min 1.5 min 1.5 min (3x) January 1996 4 Rev 1.000 |
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