General Description

The MAX9973/MAX9974 fully integrated, high-perfor-

mance, dual-channel pin electronics driver/compara-

tor/load (DCL) with built-in level-setting digital-to-analog

converters (DACs) are ideally suited for memory and

SOC automatic test equipment (ATE) applications.

Each channel includes a three-level pin driver, a win-

dow comparator, dynamic clamps, a 1kΩ load, and

seven independent level-setting DACs.

The driver features a wide voltage range and high-speed

operation, includes high-impedance and active-termina-

tion (3rd-level drive) modes, and is highly linear even at

low voltage swings. Additionally, the driver provides high-

speed differential multiplexer control inputs, with internal

termination resistors that are compatible with ECL, LV-

PECL, LVDS, and GTL. The window comparators provide

extremely low timing variation over changes in slew rate,

pulse width, or overdrive voltage, and have open-collec-

tor outputs. When high-impedance mode is selected, the

dynamic clamps provide damping of high-speed device-

under-test (DUT) waveforms. The load facilitates fast con-

tact testing when used in conjunction with the

comparators,

and

functions

as

a

pullup

for

open-drain/collector DUT_ outputs. The MAX9973/

MAX9974 are configured through a serial interface.

The MAX9973/MAX9974 differ in two aspects: the posi-

tion of the exposed heat slug and the pin arrangement.

The MAX9973G/MAX9974G comparator outputs sink

8mA (typ), while the MAX9973H/MAX9974H compara-

tor outputs sink 16mA (typ). The devices are available

in a 64-pin (10mm x 10mm x 1.00mm) TQFP-EP pack-

age with an exposed paddle on top (MAX9973) or bot-

tom (MAX9974) for heat removal. Power dissipation is

only 700mW per channel. The full operating voltage

range is -1.5V to +6.5V. Operation is specified at an

internal die temperature of +40°C to +100°C, and fea-

tures a temperature monitor output.

Applications

Memory Testers

SOC Testers

Features

o 600Mbps at 3V High Speed

o 700mW per Channel Extremely Low Power

Dissipation

o -1.5V to +6.5V Wide Voltage Range

o 200mV to 8V Wide Voltage Swing Range

o 10nA (max) Low-Leakage Mode

o Integrated Termination On-the-Fly

(3rd-Level Drive)

o Integrated Voltage Clamps

o Passive Load or Pullup

o Very Low Timing Dispersion

o Minimal External Component Count

Dual Driver/Comparator/Load

with Internal DACs

________________________________________________________________

Maxim Integrated Products

1

Ordering Information

19-0690; Rev 0; 1/07

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at

1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

Note: Devices are available in both leaded and lead-free

packages. Specify lead free by adding a + symbol at the end

of the part number when ordering.

*

Future product—contact factory for availability.

**

EP-IDP = Exposed paddle (inverted die paddle).

PART

PIN-PACKAGE

PKG

CODE

OUTPUT

SINK

CURRENT

MAX9973GCCB

64 TQFP-EP-IDP**

(10mm x 10mm x

1.00mm)

C64E-13R

8mA

MAX9973HCCB*

64 TQFP-EP-IDP**

(10mm x 10mm x

1.00mm)

C64E-13R

16mA

MAX9974GCCB*

(10mm x 10mm x

1.00mm)

—8mA

MAX9974HCCB*

(10mm x 10mm x

1.00mm)

—

16mA

Pin Configuration appears at end of data sheet.

SPI is a trademark of Motorola Inc.