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MAS9283AASM06 Datasheet(PDF) 10 Page - Micro Analog systems |
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MAS9283AASM06 Datasheet(HTML) 10 Page - Micro Analog systems |
10 / 14 page DA9283.006 13 July 2006 10 (14) SOLDERING INFORMATION N For Eutectic Sn/Pb Maximum Reflow Temperature 240°C Maximum Number of Reflow Cycles 2 Reflow profile Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% Moisture Sensitivity Level (MSL) 1 N For Pb-Free Maximum Temperature 260°C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Matte Tin Moisture Sensitivity Level (MSL) 1 |
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