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OPA3693IDBQG4 Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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OPA3693IDBQG4 Datasheet(HTML) 2 Page - Burr-Brown (TI) |
2 / 29 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) TopView SSOP 300W 300W 300W 300W 300W 300W 1 2 3 4 5 6 7 8 -INA -INB -INC +INA DISB DISC +INB +INC 9 10 11 12 13 14 15 16 -VS +V S +V S -VS DISA OUTC OUTB OUTA OPA3693 CHA CHB CHC OPA3693 SBOS353 – DECEMBER 2006 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT MEDIA, PRODUCT PACKAGE DESIGNATOR RANGE MARKING NUMBER QUANTITY OPA3693IDBQ Rail, 75 OPA3693 SSOP-16 DBQ –40 °C to +85°C OP3693 OPA3693IDBQR Tape and Reel, 2500 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Power Supply ±6.5V DC Internal Power Dissipation See Thermal Analysis Differential Input Voltage ±1.2V Input Common-Mode Voltage Range ±V S Storage Temperature Range –40 °C to +125°C Lead Temperature (soldering, 10s) +300 °C Peak +150 °C Maximum Junction Temperature, TJ Continuous Operation, Long-Term Reliability +140 °C Human Body Model (HBM) 1500V ESD Rating Charge Device Model (CDM) 1000V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these and any other conditions beyond those specified is not supported. 2 Submit Documentation Feedback |
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