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2N6395 Datasheet(PDF) 1 Page - ON Semiconductor |
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2N6395 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 5 page © Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 6 1 Publication Order Number: 2N6394/D 2N6394 Series Preferred Device Silicon Controlled Rectifiers Reverse Blocking Thyristors Designed primarily for half-wave ac control applications, such as motor controls, heating controls and power supplies. Features • Glass Passivated Junctions with Center Gate Geometry for Greater Parameter Uniformity and Stability • Small, Rugged, Thermowatt Construction for Low Thermal Resistance, High Heat Dissipation and Durability • Blocking Voltage to 800 V • Pb−Free Packages are Available* MAXIMUM RATINGS † (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Peak Repetitive Off−State Voltage (Note 1) (TJ = −40 to 125°C, Sine Wave, 50 to 60 Hz, Gate Open) 2N6394 2N6395 2N6397 2N6399 VDRM, VRRM 50 100 400 800 V On-State RMS Current (180 ° Conduction Angles; TC = 90°C) IT(RMS) 12 A Peak Non-Repetitive Surge Current (1/2 Cycle, Sine Wave, 60 Hz, TJ = 90°C) ITSM 100 A Circuit Fusing (t = 8.3 ms) I2t 40 A2s Forward Peak Gate Power (Pulse Width ≤ 1.0 ms, TC = 90°C) PGM 20 W Forward Average Gate Power (t = 8.3 ms, TC = 90°C) PG(AV) 0.5 W Forward Peak Gate Current (Pulse Width ≤ 1.0 ms, TC = 90°C) IGM 2.0 A Operating Junction Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −40 to +150 °C MAXIMUM RATINGS † (TJ = 25°C unless otherwise noted) Rating Symbol Max Unit Thermal Resistance, Junction−to−Case RqJC 2.0 °C/W Maximum Lead Temperature for Soldering Purposes 1/8 ″ from Case for 10 Seconds TL 260 °C †Indicates JEDEC Registered Data Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com SCRs 12 AMPERES RMS 50 thru 800 VOLTS K G A Preferred devices are recommended choices for future use and best overall value. PIN ASSIGNMENT 1 2 3 Anode Gate Cathode 4 Anode See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ORDERING INFORMATION TO−220AB CASE 221A STYLE 3 1 2 3 4 2N639x = Device Code x = 4, 5, 7, or 9 G = Pb−Free Package A = Assembly Location Y = Year WW = Work Week MARKING DIAGRAM 2N639xG AYWW |
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