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TPA3200D1 Datasheet(PDF) 2 Page - Texas Instruments |
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TPA3200D1 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS TPA3200D1 SLOS442A – MAY 2005 – REVISED JULY 2005 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICE TA 44-PIN (DCP)(1) –40 °C to 85°C TPA3200D1DCP (1) The DCP package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA3200D1DCPR). over operating free-air temperature range (unless otherwise noted)(1) TPA3200D1 UNIT Supply voltage, VCC, PVCC –0.3 to 21 V VSS Supply voltage, VDD –0.3 to 6.5 V RL Load Impedance ≥3.6 Ω SHUTDOWN – 0.3 to VCC + 0.3 V Vi GAIN0, GAIN1, BCK, SCLK, DATA, LRCK, LR_SEL –0.3 to VDD + 0.3 V FORMAT, MUTE, DEMP Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature range –25 to 85 °C TJ Operating junction temperature range –25 to 150 °C Tstg Storage temperature range –65 to 150 °C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds 260 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. PACKAGE TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C (1/ θ JA) 44-pin DCP 4.89 W 39.1 mW/ °C(1) 3.13 W 2.54 W (1) Based on a JEDEC high-K PCB with the PowerPAD™ soldered to a thermal land on the printed-circuit board. See the PowerPAD Thermally Enhanced Package technical brief, literature number SLMA0002. The PowerPAD must be soldered to the PCB. 2 |
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