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TPS61150DRCT Datasheet(PDF) 2 Page - Texas Instruments

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Part # TPS61150DRCT
Description  DUAL OUTPUT BOOST WLED DRIVER USING SINGLE INDUCTOR
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS61150DRCT Datasheet(HTML) 2 Page - Texas Instruments

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DEVICE INFORMATION
1
2
3
4
5
10
9
8
7
6
IFB1
Iset1
SEL1
SEL2
Vin
IFB2
Iset2
GND
Iout
SW
10 pin 3*3 mm QFN PACKAGE
(TOP VIEW)
Exposed
Thermal
Pad
TPS61150, TPS61151
SLVS625A – FEBRUARY 2006 – REVISED MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
OVP
PACKAGE
TA
PACKAGE(1)
(Typ.)
MARKING
–40 to 85
°C
TPS61150DRCR
28 V
BCQ
–40 to 85
°C
TPS61151DRCR
22 V
BRH
–40 to 85
°C
TPS61150DRCT
28 V
BCQ
–40 to 85
°C
TPS61151DRCT
22 V
BRH
(1)
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI Web site at www.ti.com.
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
The input pin to the IC. It provides the current to the boost power stage, and also powers the
Vin
5
I
IC circuit. When Vin is below the undervoltage lockout threshold, the IC turns off and disables
outputs; thereby disconnecting the WLEDs from the input.
GND
8
O
The ground of the IC. Connect the input and output capacitors very close to this pin.
SW
6
I
This is the switching node of the IC.
The output of the constant current supply. It is directly connected to the boost converter
Iout
7
O
output.
The return path for the Iout regulation. Current regulator is connected to this pin, and it can
IFB1, IFB2
10
I
be disabled to open the current path.
ISET1,
2
Output current programming pin. The resistor connected to the pin programs its
I
ISET2
9
corresponding output current.
SEL1,
3
I
Mode selection pins. See Table 1 for details.
SEL2
4
The thermal pad should be soldered to the analog ground. If possible, use thermal via to
Thermal Pal
connect to ground plane for ideal power dissipation.
Table 1. TPS61150/1 Mode Selection
SEL1
SEL2
IFB1
IFB2
H
L
Enable
Disable
L
H
Disable
Enable
H
H
Enable
Enable
L
L
IC Shutdown
2
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