CS8122

http://onsemi.com

8

HEAT SINKS

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed to

R

qJA + RqJC ) RqCS ) RqSA

(3)

where:

functions of the package type, heatsink and the interface

between them. These values appear in heat sink data sheets

of heat sink manufacturers.

ORDERING INFORMATION

Device

Package

Shipping

CS8122YT5

TO−220

STRAIGHT

50 Units / Rail

CS8122YT5G

TO−220

STRAIGHT

(Pb−Free)

CS8122YTVA5

TO−220

VERTICAL

CS8122YTVA5G

TO−220

VERTICAL

(Pb−Free)

CS8122YTHA5

TO−220

HORIZONTAL

CS8122YTHA5G

TO−220

HORIZONTAL

(Pb−Free)