Electronic Components Datasheet Search |
|
EMA6DXV5T5 Datasheet(PDF) 3 Page - ON Semiconductor |
|
EMA6DXV5T5 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 4 page EMA6DXV5T1, EMA6DXV5T5 http://onsemi.com 3 The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 150 milliwatts. INFORMATION FOR USING THE SOT−553 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. SOT−553 POWER DISSIPATION PD = TJ(max) − TA RqJA PD = 150 °C − 25°C 833 °C/W = 150 milliwatts The power dissipation of the SOT−553 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipa- tion. Power dissipation for a surface mount device is deter- mined by TJ(max), the maximum rated junction temperature of the die, RqJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT−553 package, PD can be calculated as follows: The 833 °C/W for the SOT−553 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 150 milli- watts. There are other alternatives to achieving higher power dissipation from the SOT−553 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad®. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. There- fore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100 °C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10 °C. • The soldering temperature and time shall not exceed 260 °C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5 °C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause exces- sive thermal shock and stress which can result in damage to the device. SOT−553 1.35 0.0531 0.5 0.0197 mm inches 0.5 0.0197 1.0 0.0394 0.45 0.0177 0.3 0.0118 |
Similar Part No. - EMA6DXV5T5 |
|
Similar Description - EMA6DXV5T5 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |