MAX707, MAX708

http://onsemi.com

9

PACKAGE DIMENSIONS

Micro8

CASE 846A−02

ISSUE F

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8X

8X

6X

mm

inches

SCALE 8:1

1.04

0.041

0.38

0.015

5.28

0.208

4.24

0.167

3.20

0.126

0.65

0.0256

S

B

M

0.08 (0.003)

T

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

2.90

3.10

0.114

0.122

B

2.90

3.10

0.114

0.122

C

−−−

1.10

−−−

0.043

D

0.25

0.40

0.010

0.016

G

0.65 BSC

0.026 BSC

H

0.05

0.15

0.002

0.006

J

0.13

0.23

0.005

0.009

K

4.75

5.05

0.187

0.199

L

0.40

0.70

0.016

0.028

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH,

PROTRUSIONS OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.

−B−

−A−

D

K

G

PIN 1 ID

8 PL

0.038 (0.0015)

−T−

SEATING

PLANE

C

H

J

L