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MC100EL31DG Datasheet(PDF) 2 Page - ON Semiconductor

Part # MC100EL31DG
Description  5 V ECL D Flip-Flop With Set and Reset
Download  9 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100EL31DG Datasheet(HTML) 2 Page - ON Semiconductor

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MC10EL31, MC100EL31
http://onsemi.com
2
1
2
3
45
6
7
8
Q
VEE
VCC
Figure 1. Logic Diagram and Pinout Assignment
D
Q
CLK
R
D
S
R
S
D
L
H
X
X
X
Table 1. TRUTH TABLE
S*
L
L
H
L
H
R*
L
L
L
H
H
CLK
Z
Z
X
X
X
Q
L
H
H
L
Undef
Z = LOW to HIGH Transition
S
ECL Set Input
D
ECL Data Input
R
ECL Reset Input
CLK
ECL Clock Input
Q, Q
ECL Data Outputs
VCC
Positive Supply
VEE
Negative Supply
Table 2. PIN DESCRIPTION
FUNCTION
* Pins will default low when left open.
PIN
EP
Exposed pad must be connected to a
sufficient thermal conduit. Electrically
connect to the most negative supply
or leave floating open.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI  VCC
VI  VEE
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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