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MC100ELT28DR2 Datasheet(PDF) 2 Page - ON Semiconductor |
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MC100ELT28DR2 Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 9 page MC10ELT28, MC100ELT28 http://onsemi.com 2 Figure 1. 8−Lead Pinout (Top View) and Logic Diagram 1 2 3 45 6 7 8 QTTL GND VCC DECL DTTL QECL QECL DECL PECL TTL Table 1. PIN DESCRIPTION Pin Function QTTL TTL Outputs DTTL TTL Data Inputs QECL, QECL PECL Differential Outputs DECL, DECL PECL Differential Inputs VCC Positive Supply GND Ground EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. Table 2. ATTRIBUTES Characteristics Value ESD Protection Human Body Model > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg Pb−Free Pkg SOIC−8 TSSOP−8 DFN8 Level 1 Level 1 Level 1 Level 1 Level 3 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 71 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC Positive Power Supply GND = 0 V 7 V VIN Input Voltage GND = 0 V VI VCC 0 to 6 V Iout PECL Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder Pb Pb−Free <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. |
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