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MJF6388 Datasheet(PDF) 1 Page - ON Semiconductor |
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MJF6388 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 8 page © Semiconductor Components Industries, LLC, 2006 April, 2006 − Rev. 8 1 Publication Order Number: MJF6388/D MJF6388 (NPN), MJF6668 (PNP) Preferred Device Complementary Power Darlingtons For Isolated Package Applications Designed for general−purpose amplifiers and switching applications, where the mounting surface of the device is required to be electrically isolated from the heatsink or chassis. Features • Isolated Overmold Package, TO−220 Type • Electrically Similar to the Popular 2N6388, 2N6668, TIP102, and TIP107 • 100 VCEO(sus) • 10 A Rated Collector Current • No Isolating Washers Required • Reduced System Cost • High DC Current Gain − 1000 (Min) @ IC = 5.0 Adc • High Isolation Voltage (up to 4500 VRMS) • Case 221D is UL Recognized at 3500 VRMS: File #E69369 • Pb−Free Packages are Available* MAXIMUM RATINGS Rating Symbol Value Unit Collector−Emitter Voltage VCEO 100 Vdc Collector−Base Voltage VCB 100 Vdc Emitter−Base Voltage VEB 5.0 Vdc RMS Isolation Voltage (Note 1) Test No. 1 Per Figure 14 Test No. 2 Per Figure 15 Test No. 3 Per Figure 16 (for 1 sec, R.H. < 30%, TA = 25_C) VISOL 4500 3500 1500 V Collector Current − Continuous − Peak (Note 2) IC 10 15 Adc Base Current − Continuous IB 1.0 Adc Total Power Dissipation (Note 3) @ TC = 25_C Derate above 25_C PD 40 0.31 W W/_C Total Power Dissipation @ TA = 25_C Derate above 25_C PD 2.0 0.016 W W/_C Operating and Storage Temperature Range TJ, Tstg –65 to +150 _C THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, Junction−to−Case (Note 3) RqJC 4.0 _C/W Thermal Resistance, Junction−to−Ambient RqJA 62.5 _C/W Lead Temperature for Soldering Purposes TL 260 _C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Proper strike and creepage distance must be provided. 2. Pulse Test: Pulse Width = 5.0 ms, Duty Cycle v 10%. 3. Measurement made with thermocouple contacting the bottom insulated surface (in a location beneath the die), the devices mounted on a heatsink with thermal grease and a mounting torque of ≥ 6 in. lbs. Device Package Shipping ORDERING INFORMATION MJF6388 TO−220 FULLPACK TO−220 FULLPACK CASE 221D STYLE 2 UL RECOGNIZED 50 Units/Rail 3 1 COMPLEMENTARY SILICON POWER DARLINGTONS 10 AMPERES 100 VOLTS, 40 WATTS 2 http://onsemi.com MJF6668 50 Units/Rail MJF6668G 50 Units/Rail MJF6388G TO−220 FULLPACK (Pb−Free) 50 Units/Rail MJF6xy8 = Specific Device Code x = 3 or 6 y = 6 or 8 G= Pb−Free Package A = Assembly Location Y = Year WW = Work Week MJF6xy8G AYWW MARKING DIAGRAM TO−220 FULLPACK TO−220 FULLPACK (Pb−Free) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. |
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