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MC74LVX259 Datasheet(PDF) 7 Page - ON Semiconductor |
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MC74LVX259 Datasheet(HTML) 7 Page - ON Semiconductor |
7 / 10 page MC74LVX259 http://onsemi.com 7 ORDERING INFORMATION Device Package Shipping† MC74LVX259D SOIC−16 48 Units / Rail MC74LVX259DG SOIC−16 (Pb−Free) 48 Units / Rail MC74LVX259DR2 SOIC−16 2500 Tape & Reel MC74LVX259DR2G SOIC−16 (Pb−Free) 2500 Tape & Reel MC74LVX259DT TSSOP−16* 96 Units / Rail MC74LVX259DTR2 TSSOP−16* 2500 Tape & Reel MC74LVX259M SOEIAJ−16 50 Units / Rail MC74LVX259MG SOEIAJ−16 (Pb−Free) 50 Units / Rail MC74LVX259MEL SOEIAJ−16 2000 Tape & Reel MC74LVX259MELG SOEIAJ−16 (Pb−Free) 2000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. EMBOSSED CARRIER DIMENSIONS (See Notes 6 and 7) Tape Size B1 Max D D1 E F K P P0 P2 R T W 8 mm 4.35 mm (0.179”) 1.5 mm + 0.1 −0.0 (0.059” 0 004 1.0 mm Min (0.179”) 1.75 mm ±0.1 (0.069 ±0.004”) 3.5 mm ±0.5 (1.38 ±0.002”) 2.4 mm Max (0.094”) 4.0 mm ±0.10 (0.157 ±0.004”) 4.0 mm ±0.1 (0.157 ±0.004”) 2.0 mm ±0.1 (0.079 ±0.004”) 25 mm (0.98”) 0.6 mm (0.024) 8.3 mm (0.327) 12 mm 8.2 mm (0.323”) ( +0.004 −0.0) 1.5 mm Min (0.060) ) 5.5 mm ±0.5 (0.217 ±0.002”) 6.4 mm Max (0.252”) 4.0 mm ±0.10 (0.157 ±0.004”) 8.0 mm ±0.10 (0.315 ±0.004”) ) ) 30 mm (1.18”) 12.0 mm ±0.3 (0.470 ±0.012”) 16 mm 12.1 mm (0.476”) 7.5 mm ±0.10 (0.295 ±0.004”) 7.9 mm Max (0.311”) 4.0 mm ±0.10 (0.157 ±0.004”) 8.0 mm ±0.10 (0.315 ±0.004”) 12.0 mm ±0.10 (0.472 ±0.004”) 16.3 mm (0.642) 24 mm 20.1 mm (0.791”) 11.5 mm ±0.10 (0.453 ±0.004”) 11.9 mm Max (0.468”) 16.0 mm ±0.10 (0.63 ±0.004”) 24.3 mm (0.957) 6. Metric Dimensions Govern−English are in parentheses for reference only. 7. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. The component cannot rotate more than 10 ° within the determined cavity |
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