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MC74LVXT4053MELG Datasheet(PDF) 3 Page - ON Semiconductor |
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MC74LVXT4053MELG Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 14 page MC74LVXT4053 http://onsemi.com 3 MAXIMUM RATINGS Symbol Parameter Value Unit VEE Negative DC Supply Voltage (Referenced to GND) *7.0 to )0.5 V VCC Positive DC Supply Voltage (Referenced to GND) (Referenced to VEE) *0.5 to )7.0 *0.5 to )7.0 V VIS Analog Input Voltage VEE *0.5 to V CC )0.5 V VIN Digital Input Voltage (Referenced to GND) *0.5 to 7.0 V I DC Current, Into or Out of Any Pin $20 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 _C TJ Junction Temperature under Bias )150 _C qJA Thermal Resistance SOIC TSSOP 143 164 °C/W PD Power Dissipation in Still Air, SOIC TSSOP 500 450 mW MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 30% − 35% UL 94−V0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) u2000 u200 u1000 V ILATCHUP Latchup Performance Above VCC and Below GND at 125°C (Note 4) $300 mA Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Tested to EIA/JESD22−A114−A. 2. Tested to EIA/JESD22−A115−A. 3. Tested to JESD22−C101−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VEE Negative DC Supply Voltage (Referenced to GND) *6.0 GND V VCC Positive DC Supply Voltage (Referenced to GND) (Referenced to VEE) 2.5 2.5 6.0 6.0 V VIS Analog Input Voltage VEE VCC V VIN Digital Input Voltage (Note 5) (Referenced to GND) 0 6.0 V TA Operating Temperature Range, All Package Types *55 125 _C tr, tf Input Rise/Fall Time VCC = 3.0 V $ 0.3 V (Channel Select or Enable Inputs) VCC = 5.0 V $ 0.5 V 0 0 100 20 ns/V 5. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR Figure 3. Failure Rate vs. Time Junction Temperature TIME, YEARS |
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